KR0108167Y1 - Transfer head device - Google Patents

Transfer head device

Info

Publication number
KR0108167Y1
KR0108167Y1 KR90013087U KR900013087U KR0108167Y1 KR 0108167 Y1 KR0108167 Y1 KR 0108167Y1 KR 90013087 U KR90013087 U KR 90013087U KR 900013087 U KR900013087 U KR 900013087U KR 0108167 Y1 KR0108167 Y1 KR 0108167Y1
Authority
KR
South Korea
Prior art keywords
head device
transfer head
transfer
head
Prior art date
Application number
KR90013087U
Other languages
Korean (ko)
Inventor
Kyung-Hoon Kim
Original Assignee
Samsung Aerospace Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Aerospace Ind filed Critical Samsung Aerospace Ind
Priority to KR90013087U priority Critical patent/KR0108167Y1/en
Application granted granted Critical
Publication of KR0108167Y1 publication Critical patent/KR0108167Y1/en

Links

KR90013087U 1990-08-29 1990-08-29 Transfer head device KR0108167Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR90013087U KR0108167Y1 (en) 1990-08-29 1990-08-29 Transfer head device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR90013087U KR0108167Y1 (en) 1990-08-29 1990-08-29 Transfer head device

Publications (1)

Publication Number Publication Date
KR0108167Y1 true KR0108167Y1 (en) 1997-10-21

Family

ID=19302677

Family Applications (1)

Application Number Title Priority Date Filing Date
KR90013087U KR0108167Y1 (en) 1990-08-29 1990-08-29 Transfer head device

Country Status (1)

Country Link
KR (1) KR0108167Y1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101290307B1 (en) * 2011-12-13 2013-07-26 주식회사 아이. 피. 에스시스템 Apparatus for Bonding Chip
KR20150029361A (en) * 2013-09-10 2015-03-18 (주)제이티 Device handler

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101290307B1 (en) * 2011-12-13 2013-07-26 주식회사 아이. 피. 에스시스템 Apparatus for Bonding Chip
KR20150029361A (en) * 2013-09-10 2015-03-18 (주)제이티 Device handler

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Legal Events

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Payment date: 20020731

Year of fee payment: 6

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