JPWO2025216077A1 - - Google Patents
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- Publication number
- JPWO2025216077A1 JPWO2025216077A1 JP2025536327A JP2025536327A JPWO2025216077A1 JP WO2025216077 A1 JPWO2025216077 A1 JP WO2025216077A1 JP 2025536327 A JP2025536327 A JP 2025536327A JP 2025536327 A JP2025536327 A JP 2025536327A JP WO2025216077 A1 JPWO2025216077 A1 JP WO2025216077A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024062316 | 2024-04-08 | ||
| JP2024062316 | 2024-04-08 | ||
| PCT/JP2025/012430 WO2025216077A1 (ja) | 2024-04-08 | 2025-03-27 | 導電材料、接続構造体及び接続構造体の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP7751157B1 JP7751157B1 (ja) | 2025-10-07 |
| JPWO2025216077A1 true JPWO2025216077A1 (https=) | 2025-10-16 |
| JPWO2025216077A5 JPWO2025216077A5 (https=) | 2026-03-17 |
Family
ID=97264463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025536327A Active JP7751157B1 (ja) | 2024-04-08 | 2025-03-27 | 導電材料、接続構造体及び接続構造体の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP7751157B1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3694948B2 (ja) * | 1994-12-07 | 2005-09-14 | 株式会社デンソー | はんだ付用フラックス及びはんだペースト及びそれらを用いたはんだ付方法 |
| JP4818181B2 (ja) * | 2007-03-30 | 2011-11-16 | 富士通株式会社 | 半田ペースト、部品搭載方法及び部品搭載装置 |
| JP6566095B2 (ja) * | 2017-07-28 | 2019-08-28 | 三菱マテリアル株式会社 | はんだペースト用フラックス、はんだペースト、はんだペーストを用いたはんだバンプの形成方法及び接合体の製造方法 |
-
2025
- 2025-03-27 JP JP2025536327A patent/JP7751157B1/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP7751157B1 (ja) | 2025-10-07 |
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