JPWO2025134854A1 - - Google Patents
Info
- Publication number
- JPWO2025134854A1 JPWO2025134854A1 JP2025565264A JP2025565264A JPWO2025134854A1 JP WO2025134854 A1 JPWO2025134854 A1 JP WO2025134854A1 JP 2025565264 A JP2025565264 A JP 2025565264A JP 2025565264 A JP2025565264 A JP 2025565264A JP WO2025134854 A1 JPWO2025134854 A1 JP WO2025134854A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F287/00—Macromolecular compounds obtained by polymerising monomers on to block polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Reinforced Plastic Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023213189 | 2023-12-18 | ||
| PCT/JP2024/043512 WO2025134854A1 (ja) | 2023-12-18 | 2024-12-10 | 樹脂組成物、樹脂フィルム、プリプレグ、積層板、プリント配線板及び半導体パッケージ |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2025134854A1 true JPWO2025134854A1 (https=) | 2025-06-26 |
Family
ID=96136896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025565264A Pending JPWO2025134854A1 (https=) | 2023-12-18 | 2024-12-10 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2025134854A1 (https=) |
| CN (1) | CN121079354A (https=) |
| TW (1) | TW202536076A (https=) |
| WO (1) | WO2025134854A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022102782A1 (ja) * | 2020-11-16 | 2022-05-19 | 昭和電工マテリアルズ株式会社 | マレイミド樹脂組成物、プリプレグ、積層板、樹脂フィルム、プリント配線板及び半導体パッケージ |
| KR20230108275A (ko) * | 2020-11-16 | 2023-07-18 | 가부시끼가이샤 레조낙 | 말레이미드 수지 조성물, 프리프레그, 적층판, 수지 필름, 프린트 배선판 및 반도체 패키지 |
| JP7666047B2 (ja) * | 2021-03-22 | 2025-04-22 | 味の素株式会社 | 樹脂シート |
| JP7826690B2 (ja) * | 2021-12-23 | 2026-03-10 | 株式会社レゾナック | 熱硬化性樹脂組成物、プリプレグ、樹脂フィルム、積層板、プリント配線板及び半導体パッケージ |
| JP7806522B2 (ja) * | 2022-01-28 | 2026-01-27 | 株式会社レゾナック | 樹脂組成物、プリプレグ、積層板、樹脂フィルム、プリント配線板及び半導体パッケージ |
-
2024
- 2024-12-10 JP JP2025565264A patent/JPWO2025134854A1/ja active Pending
- 2024-12-10 CN CN202480028619.5A patent/CN121079354A/zh active Pending
- 2024-12-10 WO PCT/JP2024/043512 patent/WO2025134854A1/ja active Pending
- 2024-12-11 TW TW113148080A patent/TW202536076A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202536076A (zh) | 2025-09-16 |
| CN121079354A (zh) | 2025-12-05 |
| WO2025134854A1 (ja) | 2025-06-26 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20260107 |