JPWO2024257543A1 - - Google Patents
Info
- Publication number
- JPWO2024257543A1 JPWO2024257543A1 JP2025527580A JP2025527580A JPWO2024257543A1 JP WO2024257543 A1 JPWO2024257543 A1 JP WO2024257543A1 JP 2025527580 A JP2025527580 A JP 2025527580A JP 2025527580 A JP2025527580 A JP 2025527580A JP WO2024257543 A1 JPWO2024257543 A1 JP WO2024257543A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/811—Multiple chips on leadframes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/411—Chip-supporting parts, e.g. die pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
- H10W70/424—Cross-sectional shapes
- H10W70/427—Bent parts
- H10W70/429—Bent parts being the outer leads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023096057 | 2023-06-12 | ||
| PCT/JP2024/018091 WO2024257543A1 (ja) | 2023-06-12 | 2024-05-16 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024257543A1 true JPWO2024257543A1 (https=) | 2024-12-19 |
| JPWO2024257543A5 JPWO2024257543A5 (https=) | 2026-03-12 |
Family
ID=93852078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025527580A Pending JPWO2024257543A1 (https=) | 2023-06-12 | 2024-05-16 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20260090404A1 (https=) |
| JP (1) | JPWO2024257543A1 (https=) |
| CN (1) | CN121312323A (https=) |
| DE (1) | DE112024002507T5 (https=) |
| WO (1) | WO2024257543A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5380244B2 (ja) * | 2009-10-22 | 2014-01-08 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| JP5755186B2 (ja) * | 2012-06-25 | 2015-07-29 | 三菱電機株式会社 | 半導体装置の製造方法および半導体装置 |
| JP7527916B2 (ja) | 2020-09-29 | 2024-08-05 | ローム株式会社 | 半導体装置 |
| CN116670830A (zh) * | 2020-12-25 | 2023-08-29 | 罗姆股份有限公司 | 半导体器件 |
-
2024
- 2024-05-16 CN CN202480037697.1A patent/CN121312323A/zh active Pending
- 2024-05-16 WO PCT/JP2024/018091 patent/WO2024257543A1/ja not_active Ceased
- 2024-05-16 DE DE112024002507.2T patent/DE112024002507T5/de active Pending
- 2024-05-16 JP JP2025527580A patent/JPWO2024257543A1/ja active Pending
-
2025
- 2025-12-05 US US19/410,050 patent/US20260090404A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE112024002507T5 (de) | 2026-03-26 |
| CN121312323A (zh) | 2026-01-09 |
| US20260090404A1 (en) | 2026-03-26 |
| WO2024257543A1 (ja) | 2024-12-19 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20251205 |