JPWO2024247629A1 - - Google Patents

Info

Publication number
JPWO2024247629A1
JPWO2024247629A1 JP2025523396A JP2025523396A JPWO2024247629A1 JP WO2024247629 A1 JPWO2024247629 A1 JP WO2024247629A1 JP 2025523396 A JP2025523396 A JP 2025523396A JP 2025523396 A JP2025523396 A JP 2025523396A JP WO2024247629 A1 JPWO2024247629 A1 JP WO2024247629A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025523396A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024247629A1 publication Critical patent/JPWO2024247629A1/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
JP2025523396A 2023-06-02 2024-05-08 Pending JPWO2024247629A1 (https=)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023091939 2023-06-02
JP2023106758 2023-06-29
PCT/JP2024/017080 WO2024247629A1 (ja) 2023-06-02 2024-05-08 半導体装置および車両

Publications (1)

Publication Number Publication Date
JPWO2024247629A1 true JPWO2024247629A1 (https=) 2024-12-05

Family

ID=93657298

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025523396A Pending JPWO2024247629A1 (https=) 2023-06-02 2024-05-08

Country Status (2)

Country Link
JP (1) JPWO2024247629A1 (https=)
WO (1) WO2024247629A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025164225A1 (ja) * 2024-01-30 2025-08-07 ローム株式会社 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4829690B2 (ja) * 2006-06-09 2011-12-07 本田技研工業株式会社 半導体装置
DE112019005844T5 (de) * 2018-11-22 2021-08-12 Rohm Co., Ltd. Halbleiterbauteil
US20230245956A1 (en) * 2020-10-14 2023-08-03 Rohm Co., Ltd. Semiconductor module
JP7424347B2 (ja) * 2021-05-27 2024-01-30 株式会社デンソー 半導体装置

Also Published As

Publication number Publication date
WO2024247629A1 (ja) 2024-12-05

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