JPWO2024247326A1 - - Google Patents
Info
- Publication number
- JPWO2024247326A1 JPWO2024247326A1 JP2024529434A JP2024529434A JPWO2024247326A1 JP WO2024247326 A1 JPWO2024247326 A1 JP WO2024247326A1 JP 2024529434 A JP2024529434 A JP 2024529434A JP 2024529434 A JP2024529434 A JP 2024529434A JP WO2024247326 A1 JPWO2024247326 A1 JP WO2024247326A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
- H10N30/057—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by stacking bulk piezoelectric or electrostrictive bodies and electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023089718 | 2023-05-31 | ||
| JP2023089718 | 2023-05-31 | ||
| PCT/JP2023/044667 WO2024247326A1 (ja) | 2023-05-31 | 2023-12-13 | 電子部品 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024247326A1 true JPWO2024247326A1 (https=) | 2024-12-05 |
| JPWO2024247326A5 JPWO2024247326A5 (https=) | 2025-05-13 |
| JP7715289B2 JP7715289B2 (ja) | 2025-07-30 |
Family
ID=93656969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024529434A Active JP7715289B2 (ja) | 2023-05-31 | 2023-12-13 | 電子部品 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20250191846A1 (https=) |
| JP (1) | JP7715289B2 (https=) |
| WO (1) | WO2024247326A1 (https=) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013069713A (ja) * | 2011-09-20 | 2013-04-18 | Tdk Corp | チップ型電子部品及びチップ型電子部品の製造方法 |
| JP2014039000A (ja) * | 2012-08-10 | 2014-02-27 | Samsung Electro-Mechanics Co Ltd | 積層セラミックキャパシタ及びその製造方法。 |
| US20150090483A1 (en) * | 2013-09-30 | 2015-04-02 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor, manufacturing method thereof, and board having the same mounted thereon |
| KR20190004631A (ko) * | 2017-07-04 | 2019-01-14 | 삼성전기주식회사 | 적층 세라믹 커패시터 |
| US20200185153A1 (en) * | 2018-12-11 | 2020-06-11 | Samsung Electro-Mechanics Co., Ltd. | Capacitor component |
| JP2021174956A (ja) * | 2020-04-30 | 2021-11-01 | 株式会社村田製作所 | 積層セラミックコンデンサ |
-
2023
- 2023-12-13 WO PCT/JP2023/044667 patent/WO2024247326A1/ja not_active Ceased
- 2023-12-13 JP JP2024529434A patent/JP7715289B2/ja active Active
-
2025
- 2025-02-21 US US19/059,361 patent/US20250191846A1/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013069713A (ja) * | 2011-09-20 | 2013-04-18 | Tdk Corp | チップ型電子部品及びチップ型電子部品の製造方法 |
| JP2014039000A (ja) * | 2012-08-10 | 2014-02-27 | Samsung Electro-Mechanics Co Ltd | 積層セラミックキャパシタ及びその製造方法。 |
| US20150090483A1 (en) * | 2013-09-30 | 2015-04-02 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor, manufacturing method thereof, and board having the same mounted thereon |
| KR20190004631A (ko) * | 2017-07-04 | 2019-01-14 | 삼성전기주식회사 | 적층 세라믹 커패시터 |
| US20200185153A1 (en) * | 2018-12-11 | 2020-06-11 | Samsung Electro-Mechanics Co., Ltd. | Capacitor component |
| JP2021174956A (ja) * | 2020-04-30 | 2021-11-01 | 株式会社村田製作所 | 積層セラミックコンデンサ |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7715289B2 (ja) | 2025-07-30 |
| WO2024247326A1 (ja) | 2024-12-05 |
| US20250191846A1 (en) | 2025-06-12 |
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