JPWO2024209940A1 - - Google Patents

Info

Publication number
JPWO2024209940A1
JPWO2024209940A1 JP2025512483A JP2025512483A JPWO2024209940A1 JP WO2024209940 A1 JPWO2024209940 A1 JP WO2024209940A1 JP 2025512483 A JP2025512483 A JP 2025512483A JP 2025512483 A JP2025512483 A JP 2025512483A JP WO2024209940 A1 JPWO2024209940 A1 JP WO2024209940A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025512483A
Other languages
Japanese (ja)
Other versions
JPWO2024209940A5 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024209940A1 publication Critical patent/JPWO2024209940A1/ja
Publication of JPWO2024209940A5 publication Critical patent/JPWO2024209940A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C09J171/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
JP2025512483A 2023-04-06 2024-03-21 Pending JPWO2024209940A1 (enrdf_load_stackoverflow)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023061961 2023-04-06
PCT/JP2024/010925 WO2024209940A1 (ja) 2023-04-06 2024-03-21 熱硬化型接着シート及びプリント配線板

Publications (2)

Publication Number Publication Date
JPWO2024209940A1 true JPWO2024209940A1 (enrdf_load_stackoverflow) 2024-10-10
JPWO2024209940A5 JPWO2024209940A5 (enrdf_load_stackoverflow) 2025-06-05

Family

ID=92973128

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025512483A Pending JPWO2024209940A1 (enrdf_load_stackoverflow) 2023-04-06 2024-03-21

Country Status (4)

Country Link
JP (1) JPWO2024209940A1 (enrdf_load_stackoverflow)
CN (1) CN120359277A (enrdf_load_stackoverflow)
TW (1) TW202502994A (enrdf_load_stackoverflow)
WO (1) WO2024209940A1 (enrdf_load_stackoverflow)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021024364A1 (ja) * 2019-08-06 2021-02-11 デクセリアルズ株式会社 接着剤組成物、熱硬化性接着シート及びプリント配線板
WO2022004476A1 (ja) * 2020-07-01 2022-01-06 信越ポリマー株式会社 接着剤組成物
JP7158600B2 (ja) * 2019-10-16 2022-10-21 旭化成株式会社 スペーサー及びその製造方法、並びに複合体
WO2022255078A1 (ja) * 2021-06-02 2022-12-08 ナミックス株式会社 樹脂組成物及びその製造方法、並びに接着フィルム及び層間接着用ボンディングシート

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7555684B2 (ja) * 2021-11-10 2024-09-25 信越化学工業株式会社 熱硬化性マレイミド樹脂組成物
CN113969122B (zh) * 2021-11-25 2024-06-18 华烁科技股份有限公司 一种低介电热固型胶粘剂组合物及其制备方法和挠性覆铜板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021024364A1 (ja) * 2019-08-06 2021-02-11 デクセリアルズ株式会社 接着剤組成物、熱硬化性接着シート及びプリント配線板
JP7158600B2 (ja) * 2019-10-16 2022-10-21 旭化成株式会社 スペーサー及びその製造方法、並びに複合体
WO2022004476A1 (ja) * 2020-07-01 2022-01-06 信越ポリマー株式会社 接着剤組成物
WO2022255078A1 (ja) * 2021-06-02 2022-12-08 ナミックス株式会社 樹脂組成物及びその製造方法、並びに接着フィルム及び層間接着用ボンディングシート

Also Published As

Publication number Publication date
WO2024209940A1 (ja) 2024-10-10
TW202502994A (zh) 2025-01-16
CN120359277A (zh) 2025-07-22

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