JPWO2024190397A1 - - Google Patents
Info
- Publication number
- JPWO2024190397A1 JPWO2024190397A1 JP2025506672A JP2025506672A JPWO2024190397A1 JP WO2024190397 A1 JPWO2024190397 A1 JP WO2024190397A1 JP 2025506672 A JP2025506672 A JP 2025506672A JP 2025506672 A JP2025506672 A JP 2025506672A JP WO2024190397 A1 JPWO2024190397 A1 JP WO2024190397A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/811—Multiple chips on leadframes
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023040763 | 2023-03-15 | ||
| PCT/JP2024/007012 WO2024190397A1 (ja) | 2023-03-15 | 2024-02-27 | 電子装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024190397A1 true JPWO2024190397A1 (https=) | 2024-09-19 |
| JPWO2024190397A5 JPWO2024190397A5 (https=) | 2025-12-02 |
Family
ID=92754973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025506672A Pending JPWO2024190397A1 (https=) | 2023-03-15 | 2024-02-27 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20260005087A1 (https=) |
| JP (1) | JPWO2024190397A1 (https=) |
| WO (1) | WO2024190397A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016072012A1 (ja) * | 2014-11-07 | 2016-05-12 | 三菱電機株式会社 | 電力用半導体装置およびその製造方法 |
| JP7001826B2 (ja) * | 2018-07-12 | 2022-01-20 | ローム株式会社 | 半導体装置 |
| JP7541456B2 (ja) * | 2020-09-10 | 2024-08-28 | ローム株式会社 | 半導体装置 |
| JPWO2022145177A1 (https=) * | 2021-01-04 | 2022-07-07 |
-
2024
- 2024-02-27 WO PCT/JP2024/007012 patent/WO2024190397A1/ja not_active Ceased
- 2024-02-27 JP JP2025506672A patent/JPWO2024190397A1/ja active Pending
-
2025
- 2025-09-08 US US19/322,030 patent/US20260005087A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20260005087A1 (en) | 2026-01-01 |
| WO2024190397A1 (ja) | 2024-09-19 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250908 |