JPWO2024154566A1 - - Google Patents
Info
- Publication number
- JPWO2024154566A1 JPWO2024154566A1 JP2024571683A JP2024571683A JPWO2024154566A1 JP WO2024154566 A1 JPWO2024154566 A1 JP WO2024154566A1 JP 2024571683 A JP2024571683 A JP 2024571683A JP 2024571683 A JP2024571683 A JP 2024571683A JP WO2024154566 A1 JPWO2024154566 A1 JP WO2024154566A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023004347 | 2023-01-16 | ||
| PCT/JP2023/046940 WO2024154566A1 (ja) | 2023-01-16 | 2023-12-27 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024154566A1 true JPWO2024154566A1 (https=) | 2024-07-25 |
| JPWO2024154566A5 JPWO2024154566A5 (https=) | 2025-09-25 |
Family
ID=91955863
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024571683A Pending JPWO2024154566A1 (https=) | 2023-01-16 | 2023-12-27 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024154566A1 (https=) |
| WO (1) | WO2024154566A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8253225B2 (en) * | 2008-02-22 | 2012-08-28 | Infineon Technologies Ag | Device including semiconductor chip and leads coupled to the semiconductor chip and manufacturing thereof |
| JP2010003917A (ja) * | 2008-06-20 | 2010-01-07 | Toshiba Components Co Ltd | Ｓｉｐ型樹脂封止半導体装置 |
| US11482479B2 (en) * | 2017-04-24 | 2022-10-25 | Rohm Co., Ltd. | Semiconductor device |
| US11502014B2 (en) * | 2018-09-19 | 2022-11-15 | Rohm Co., Ltd. | Semiconductor device |
-
2023
- 2023-12-27 WO PCT/JP2023/046940 patent/WO2024154566A1/ja not_active Ceased
- 2023-12-27 JP JP2024571683A patent/JPWO2024154566A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024154566A1 (ja) | 2024-07-25 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250707 |