JPWO2024018932A1 - - Google Patents

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Publication number
JPWO2024018932A1
JPWO2024018932A1 JP2024535026A JP2024535026A JPWO2024018932A1 JP WO2024018932 A1 JPWO2024018932 A1 JP WO2024018932A1 JP 2024535026 A JP2024535026 A JP 2024535026A JP 2024535026 A JP2024535026 A JP 2024535026A JP WO2024018932 A1 JPWO2024018932 A1 JP WO2024018932A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2024535026A
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Japanese (ja)
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JP7658515B2 (ja
JPWO2024018932A5 (https=
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Publication of JPWO2024018932A1 publication Critical patent/JPWO2024018932A1/ja
Publication of JPWO2024018932A5 publication Critical patent/JPWO2024018932A5/ja
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Publication of JP7658515B2 publication Critical patent/JP7658515B2/ja
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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/16Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)
JP2024535026A 2022-07-20 2023-07-07 センサモジュール Active JP7658515B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022115493 2022-07-20
JP2022115493 2022-07-20
PCT/JP2023/025326 WO2024018932A1 (ja) 2022-07-20 2023-07-07 センサモジュール

Publications (3)

Publication Number Publication Date
JPWO2024018932A1 true JPWO2024018932A1 (https=) 2024-01-25
JPWO2024018932A5 JPWO2024018932A5 (https=) 2025-02-21
JP7658515B2 JP7658515B2 (ja) 2025-04-08

Family

ID=89617846

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024535026A Active JP7658515B2 (ja) 2022-07-20 2023-07-07 センサモジュール

Country Status (3)

Country Link
JP (1) JP7658515B2 (https=)
CN (1) CN119563093A (https=)
WO (1) WO2024018932A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012137897A1 (ja) * 2011-04-08 2012-10-11 株式会社村田製作所 変位センサ、変位検出装置、および操作デバイス
WO2017183678A1 (ja) * 2016-04-22 2017-10-26 株式会社村田製作所 モニタリングシステム
JP2018060308A (ja) * 2016-10-04 2018-04-12 株式会社村田製作所 押圧力検知センサおよび電子機器
CN213122750U (zh) * 2020-05-25 2021-05-04 华为技术有限公司 一种触控板模组及终端设备
JP2021197167A (ja) * 2020-06-09 2021-12-27 株式会社村田製作所 電子機器

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012137897A1 (ja) * 2011-04-08 2012-10-11 株式会社村田製作所 変位センサ、変位検出装置、および操作デバイス
WO2017183678A1 (ja) * 2016-04-22 2017-10-26 株式会社村田製作所 モニタリングシステム
JP2018060308A (ja) * 2016-10-04 2018-04-12 株式会社村田製作所 押圧力検知センサおよび電子機器
CN213122750U (zh) * 2020-05-25 2021-05-04 华为技术有限公司 一种触控板模组及终端设备
JP2021197167A (ja) * 2020-06-09 2021-12-27 株式会社村田製作所 電子機器

Also Published As

Publication number Publication date
WO2024018932A1 (ja) 2024-01-25
CN119563093A (zh) 2025-03-04
JP7658515B2 (ja) 2025-04-08

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