JPWO2024005035A1 - - Google Patents
Info
- Publication number
- JPWO2024005035A1 JPWO2024005035A1 JP2024530896A JP2024530896A JPWO2024005035A1 JP WO2024005035 A1 JPWO2024005035 A1 JP WO2024005035A1 JP 2024530896 A JP2024530896 A JP 2024530896A JP 2024530896 A JP2024530896 A JP 2024530896A JP WO2024005035 A1 JPWO2024005035 A1 JP WO2024005035A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
- H01J37/32724—Temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3266—Magnetic control means
- H01J37/32669—Particular magnets or magnet arrangements for controlling the discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32926—Software, data control or modelling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
- H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Electromagnetism (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022106263 | 2022-06-30 | ||
| PCT/JP2023/023874 WO2024005035A1 (ja) | 2022-06-30 | 2023-06-27 | プラズマ処理方法及びプラズマ処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024005035A1 true JPWO2024005035A1 (https=) | 2024-01-04 |
| JPWO2024005035A5 JPWO2024005035A5 (https=) | 2026-04-13 |
Family
ID=89382300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024530896A Pending JPWO2024005035A1 (https=) | 2022-06-30 | 2023-06-27 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20250149316A1 (https=) |
| JP (1) | JPWO2024005035A1 (https=) |
| KR (1) | KR20250029901A (https=) |
| CN (1) | CN119487618A (https=) |
| TW (1) | TW202420381A (https=) |
| WO (1) | WO2024005035A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5451784A (en) * | 1994-10-31 | 1995-09-19 | Applied Materials, Inc. | Composite diagnostic wafer for semiconductor wafer processing systems |
| US5801386A (en) * | 1995-12-11 | 1998-09-01 | Applied Materials, Inc. | Apparatus for measuring plasma characteristics within a semiconductor wafer processing system and a method of fabricating and using same |
| WO2000068986A1 (fr) * | 1999-05-07 | 2000-11-16 | Tokyo Electron Limited | Procédé et appareil de traitement sous vide |
| JP4175456B2 (ja) | 2002-03-26 | 2008-11-05 | 株式会社 東北テクノアーチ | オンウエハ・モニタリング・システム |
| US7829468B2 (en) * | 2006-06-07 | 2010-11-09 | Lam Research Corporation | Method and apparatus to detect fault conditions of plasma processing reactor |
| US10916411B2 (en) * | 2018-08-13 | 2021-02-09 | Tokyo Electron Limited | Sensor-to-sensor matching methods for chamber matching |
-
2023
- 2023-06-27 JP JP2024530896A patent/JPWO2024005035A1/ja active Pending
- 2023-06-27 KR KR1020257002415A patent/KR20250029901A/ko active Pending
- 2023-06-27 CN CN202380049160.2A patent/CN119487618A/zh active Pending
- 2023-06-27 WO PCT/JP2023/023874 patent/WO2024005035A1/ja not_active Ceased
- 2023-06-30 TW TW112124601A patent/TW202420381A/zh unknown
-
2024
- 2024-12-30 US US19/004,463 patent/US20250149316A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR20250029901A (ko) | 2025-03-05 |
| WO2024005035A1 (ja) | 2024-01-04 |
| CN119487618A (zh) | 2025-02-18 |
| US20250149316A1 (en) | 2025-05-08 |
| TW202420381A (zh) | 2024-05-16 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20260403 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20260403 |