JPWO2023286333A1 - - Google Patents

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Publication number
JPWO2023286333A1
JPWO2023286333A1 JP2023535108A JP2023535108A JPWO2023286333A1 JP WO2023286333 A1 JPWO2023286333 A1 JP WO2023286333A1 JP 2023535108 A JP2023535108 A JP 2023535108A JP 2023535108 A JP2023535108 A JP 2023535108A JP WO2023286333 A1 JPWO2023286333 A1 JP WO2023286333A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023535108A
Other versions
JP7467778B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023286333A1 publication Critical patent/JPWO2023286333A1/ja
Application granted granted Critical
Publication of JP7467778B2 publication Critical patent/JP7467778B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2023535108A 2021-07-15 2022-03-04 半導体モジュール冷却構造 Active JP7467778B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021117432 2021-07-15
JP2021117432 2021-07-15
PCT/JP2022/009578 WO2023286333A1 (ja) 2021-07-15 2022-03-04 半導体モジュール冷却構造

Publications (2)

Publication Number Publication Date
JPWO2023286333A1 true JPWO2023286333A1 (ja) 2023-01-19
JP7467778B2 JP7467778B2 (ja) 2024-04-15

Family

ID=84919236

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023535108A Active JP7467778B2 (ja) 2021-07-15 2022-03-04 半導体モジュール冷却構造

Country Status (2)

Country Link
JP (1) JP7467778B2 (ja)
WO (1) WO2023286333A1 (ja)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5163160B2 (ja) 2008-02-01 2013-03-13 株式会社デンソー 半導体冷却構造
JP2014067902A (ja) 2012-09-26 2014-04-17 Toyota Industries Corp 半導体装置
JP6882932B2 (ja) 2017-05-12 2021-06-02 矢崎総業株式会社 電子部品の固定構造

Also Published As

Publication number Publication date
JP7467778B2 (ja) 2024-04-15
WO2023286333A1 (ja) 2023-01-19

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