JPWO2023281906A1 - - Google Patents
Info
- Publication number
- JPWO2023281906A1 JPWO2023281906A1 JP2023533448A JP2023533448A JPWO2023281906A1 JP WO2023281906 A1 JPWO2023281906 A1 JP WO2023281906A1 JP 2023533448 A JP2023533448 A JP 2023533448A JP 2023533448 A JP2023533448 A JP 2023533448A JP WO2023281906 A1 JPWO2023281906 A1 JP WO2023281906A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021113987 | 2021-07-09 | ||
| PCT/JP2022/019362 WO2023281906A1 (en) | 2021-07-09 | 2022-04-28 | Heat-curable adhesive sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023281906A1 true JPWO2023281906A1 (en) | 2023-01-12 |
Family
ID=84800214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023533448A Pending JPWO2023281906A1 (en) | 2021-07-09 | 2022-04-28 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2023281906A1 (en) |
| CN (1) | CN117616093A (en) |
| TW (1) | TW202313752A (en) |
| WO (1) | WO2023281906A1 (en) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4258984B2 (en) * | 2001-03-15 | 2009-04-30 | 日立化成工業株式会社 | Manufacturing method of semiconductor device |
| JP4776188B2 (en) * | 2004-08-03 | 2011-09-21 | 古河電気工業株式会社 | Semiconductor device manufacturing method and wafer processing tape |
| KR100938745B1 (en) * | 2007-11-28 | 2010-01-26 | 제일모직주식회사 | Adhesive Composition for Die Bonding in Semiconductor Assembly with high boiling point solvent and low boiling point solvent and Adhesive Film Prepared Therefrom |
| WO2014017537A1 (en) * | 2012-07-26 | 2014-01-30 | 古河電気工業株式会社 | Method for manufacturing semiconductor-wafer-processing tape and semiconductor-wafer-processing tape |
| JP6289311B2 (en) * | 2014-08-29 | 2018-03-07 | 積水化成品工業株式会社 | Adhesive composition, adhesive sheet, adhesion method for adherend and composite material |
| JP6353990B1 (en) * | 2016-09-07 | 2018-07-04 | リンテック株式会社 | Adhesive composition, sealing sheet, and sealing body |
-
2022
- 2022-04-28 JP JP2023533448A patent/JPWO2023281906A1/ja active Pending
- 2022-04-28 CN CN202280048449.8A patent/CN117616093A/en active Pending
- 2022-04-28 WO PCT/JP2022/019362 patent/WO2023281906A1/en active Application Filing
- 2022-06-30 TW TW111124470A patent/TW202313752A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202313752A (en) | 2023-04-01 |
| WO2023281906A1 (en) | 2023-01-12 |
| CN117616093A (en) | 2024-02-27 |