JPWO2023281868A1 - - Google Patents

Info

Publication number
JPWO2023281868A1
JPWO2023281868A1 JP2023533429A JP2023533429A JPWO2023281868A1 JP WO2023281868 A1 JPWO2023281868 A1 JP WO2023281868A1 JP 2023533429 A JP2023533429 A JP 2023533429A JP 2023533429 A JP2023533429 A JP 2023533429A JP WO2023281868 A1 JPWO2023281868 A1 JP WO2023281868A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023533429A
Other versions
JPWO2023281868A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023281868A1 publication Critical patent/JPWO2023281868A1/ja
Publication of JPWO2023281868A5 publication Critical patent/JPWO2023281868A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2023533429A 2021-07-09 2022-03-28 Pending JPWO2023281868A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021114406 2021-07-09
PCT/JP2022/015071 WO2023281868A1 (ja) 2021-07-09 2022-03-28 接合構造体

Publications (2)

Publication Number Publication Date
JPWO2023281868A1 true JPWO2023281868A1 (ja) 2023-01-12
JPWO2023281868A5 JPWO2023281868A5 (ja) 2024-04-03

Family

ID=84801724

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023533429A Pending JPWO2023281868A1 (ja) 2021-07-09 2022-03-28

Country Status (3)

Country Link
JP (1) JPWO2023281868A1 (ja)
CN (1) CN117616880A (ja)
WO (1) WO2023281868A1 (ja)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004031651A (ja) * 2002-06-26 2004-01-29 Sony Corp 素子実装基板及びその製造方法
JP2006080322A (ja) * 2004-09-10 2006-03-23 Ishizuka Electronics Corp チップ型複合電子部品
US10034609B2 (en) * 2015-11-05 2018-07-31 Nano And Advanced Materials Institute Limited Temperature sensor for tracking body temperature based on printable nanomaterial thermistor
JP6996634B2 (ja) * 2018-08-10 2022-01-17 株式会社村田製作所 サーミスタ、及び、サーミスタの製造方法

Also Published As

Publication number Publication date
CN117616880A (zh) 2024-02-27
WO2023281868A1 (ja) 2023-01-12

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