JPWO2023281778A1 - - Google Patents
Info
- Publication number
- JPWO2023281778A1 JPWO2023281778A1 JP2023533047A JP2023533047A JPWO2023281778A1 JP WO2023281778 A1 JPWO2023281778 A1 JP WO2023281778A1 JP 2023533047 A JP2023533047 A JP 2023533047A JP 2023533047 A JP2023533047 A JP 2023533047A JP WO2023281778 A1 JPWO2023281778 A1 JP WO2023281778A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/16—Electroplating with layers of varying thickness
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Electrochemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021114585 | 2021-07-09 | ||
| PCT/JP2022/001221 WO2023281778A1 (ja) | 2021-07-09 | 2022-01-14 | 表面処理銅箔、銅張積層板及びプリント配線板 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023281778A1 true JPWO2023281778A1 (hu) | 2023-01-12 |
Family
ID=84800489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023533047A Pending JPWO2023281778A1 (hu) | 2021-07-09 | 2022-01-14 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2023281778A1 (hu) |
| KR (1) | KR20230121117A (hu) |
| CN (1) | CN116710601A (hu) |
| TW (1) | TW202302917A (hu) |
| WO (1) | WO2023281778A1 (hu) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2351876A1 (en) * | 2008-11-25 | 2011-08-03 | JX Nippon Mining & Metals Corporation | Copper foil for printed circuit |
| SG183311A1 (en) * | 2010-05-07 | 2012-09-27 | Jx Nippon Mining & Metals Corp | Copper foil for printed circuit |
| JP2012112009A (ja) | 2010-11-26 | 2012-06-14 | Hitachi Cable Ltd | 銅箔、及び銅箔の製造方法 |
| JP2014152352A (ja) * | 2013-02-06 | 2014-08-25 | Sh Copper Products Corp | 複合銅箔および複合銅箔の製造方法 |
| WO2017006739A1 (ja) * | 2015-07-03 | 2017-01-12 | 三井金属鉱業株式会社 | 粗化処理銅箔、銅張積層板及びプリント配線板 |
| JP6200042B2 (ja) * | 2015-08-06 | 2017-09-20 | Ｊｘ金属株式会社 | キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
| US10581081B1 (en) * | 2019-02-01 | 2020-03-03 | Chang Chun Petrochemical Co., Ltd. | Copper foil for negative electrode current collector of lithium ion secondary battery |
| JP6816193B2 (ja) * | 2019-03-26 | 2021-01-20 | 古河電気工業株式会社 | 表面処理銅箔、並びにこれを用いた銅張積層板及びプリント配線板 |
| JP2021095596A (ja) * | 2019-12-13 | 2021-06-24 | Ｊｘ金属株式会社 | 表面処理銅箔、銅張積層板及びプリント配線板 |
-
2022
- 2022-01-14 KR KR1020237023854A patent/KR20230121117A/ko unknown
- 2022-01-14 CN CN202280009868.0A patent/CN116710601A/zh active Pending
- 2022-01-14 JP JP2023533047A patent/JPWO2023281778A1/ja active Pending
- 2022-01-14 WO PCT/JP2022/001221 patent/WO2023281778A1/ja active Application Filing
- 2022-01-14 TW TW111101717A patent/TW202302917A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202302917A (zh) | 2023-01-16 |
| KR20230121117A (ko) | 2023-08-17 |
| WO2023281778A1 (ja) | 2023-01-12 |
| CN116710601A (zh) | 2023-09-05 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240130 |