JPWO2023276690A1 - - Google Patents

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Publication number
JPWO2023276690A1
JPWO2023276690A1 JP2023531784A JP2023531784A JPWO2023276690A1 JP WO2023276690 A1 JPWO2023276690 A1 JP WO2023276690A1 JP 2023531784 A JP2023531784 A JP 2023531784A JP 2023531784 A JP2023531784 A JP 2023531784A JP WO2023276690 A1 JPWO2023276690 A1 JP WO2023276690A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023531784A
Other languages
Japanese (ja)
Other versions
JP7351437B2 (en
JPWO2023276690A5 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023276690A1 publication Critical patent/JPWO2023276690A1/ja
Publication of JPWO2023276690A5 publication Critical patent/JPWO2023276690A5/en
Application granted granted Critical
Publication of JP7351437B2 publication Critical patent/JP7351437B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Epoxy Resins (AREA)
  • Die Bonding (AREA)
JP2023531784A 2021-07-02 2022-06-16 Conductive resin compositions for die attach materials, high thermal conductivity materials, and semiconductor devices Active JP7351437B2 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2021110818 2021-07-02
JP2021110818 2021-07-02
JP2021163530 2021-10-04
JP2021163530 2021-10-04
PCT/JP2022/024078 WO2023276690A1 (en) 2021-07-02 2022-06-16 Conductive resin composition, material having high thermal conductivity, and semiconductor device

Publications (3)

Publication Number Publication Date
JPWO2023276690A1 true JPWO2023276690A1 (en) 2023-01-05
JPWO2023276690A5 JPWO2023276690A5 (en) 2023-08-31
JP7351437B2 JP7351437B2 (en) 2023-09-27

Family

ID=84692327

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023531784A Active JP7351437B2 (en) 2021-07-02 2022-06-16 Conductive resin compositions for die attach materials, high thermal conductivity materials, and semiconductor devices

Country Status (4)

Country Link
JP (1) JP7351437B2 (en)
KR (1) KR20240027774A (en)
TW (1) TW202311339A (en)
WO (1) WO2023276690A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013147047A1 (en) * 2012-03-29 2013-10-03 Dic株式会社 Conductive ink composition, method for producing conductive patterns, and conductive circuit
JP2014034589A (en) * 2012-08-07 2014-02-24 Dic Corp Conductive ink composition, method for producing conductive pattern and conductive circuit
JP2014531495A (en) * 2011-09-20 2014-11-27 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンＨｅｎｋｅｌ ＡＧ ＆ Ｃｏ．ＫＧａＡ Conductive adhesive containing silver-coated particles
JP2015160932A (en) * 2014-02-28 2015-09-07 昭和電工株式会社 Conductive adhesive and electronic device using the same
CN107446520A (en) * 2017-06-29 2017-12-08 晶丰电子封装材料（武汉）有限公司 A kind of normal temperature cure conducting resinl and its process for connecting rechargeable battery pack

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102116290B1 (en) * 2013-01-30 2020-05-29 디아이씨 가부시끼가이샤 Conductive paste, method for forming conductive pattern, and object with printed conductive pattern
JP5806760B1 (en) 2014-05-29 2015-11-10 田中貴金属工業株式会社 Thermally conductive conductive adhesive composition
WO2018225773A1 (en) 2017-06-07 2018-12-13 田中貴金属工業株式会社 Thermally-conductive and electrically-conductive adhesive composition

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014531495A (en) * 2011-09-20 2014-11-27 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンＨｅｎｋｅｌ ＡＧ ＆ Ｃｏ．ＫＧａＡ Conductive adhesive containing silver-coated particles
WO2013147047A1 (en) * 2012-03-29 2013-10-03 Dic株式会社 Conductive ink composition, method for producing conductive patterns, and conductive circuit
JP2014034589A (en) * 2012-08-07 2014-02-24 Dic Corp Conductive ink composition, method for producing conductive pattern and conductive circuit
JP2015160932A (en) * 2014-02-28 2015-09-07 昭和電工株式会社 Conductive adhesive and electronic device using the same
CN107446520A (en) * 2017-06-29 2017-12-08 晶丰电子封装材料（武汉）有限公司 A kind of normal temperature cure conducting resinl and its process for connecting rechargeable battery pack

Also Published As

Publication number Publication date
JP7351437B2 (en) 2023-09-27
WO2023276690A1 (en) 2023-01-05
KR20240027774A (en) 2024-03-04
TW202311339A (en) 2023-03-16

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