JPWO2023276006A1 - - Google Patents

Info

Publication number
JPWO2023276006A1
JPWO2023276006A1 JP2023531206A JP2023531206A JPWO2023276006A1 JP WO2023276006 A1 JPWO2023276006 A1 JP WO2023276006A1 JP 2023531206 A JP2023531206 A JP 2023531206A JP 2023531206 A JP2023531206 A JP 2023531206A JP WO2023276006 A1 JPWO2023276006 A1 JP WO2023276006A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023531206A
Other languages
Japanese (ja)
Other versions
JP7500902B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023276006A1 publication Critical patent/JPWO2023276006A1/ja
Application granted granted Critical
Publication of JP7500902B2 publication Critical patent/JP7500902B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/555—Constructional details for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/811—Interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/00064—Constructional details of the endoscope body
    • A61B1/0011—Manufacturing of endoscope parts
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
    • A61B1/05—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances characterised by the image sensor, e.g. camera, being in the distal end portion
    • A61B1/051—Details of CCD assembly
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/301—Marks applied to devices, e.g. for alignment or identification for alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/601—Marks applied to devices, e.g. for alignment or identification for use after dicing
    • H10W46/607—Located on parts of packages, e.g. on encapsulations or on package substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Surgery (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Medical Informatics (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Optics & Photonics (AREA)
  • Pathology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Veterinary Medicine (AREA)
  • Biomedical Technology (AREA)
  • Physics & Mathematics (AREA)
  • Biophysics (AREA)
  • Molecular Biology (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Manufacturing & Machinery (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Endoscopes (AREA)
  • Studio Devices (AREA)
JP2023531206A 2021-06-29 2021-06-29 撮像ユニット、内視鏡、および、撮像ユニットの製造方法 Active JP7500902B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/024598 WO2023276006A1 (ja) 2021-06-29 2021-06-29 撮像ユニット、内視鏡、および、撮像ユニットの製造方法

Publications (2)

Publication Number Publication Date
JPWO2023276006A1 true JPWO2023276006A1 (https=) 2023-01-05
JP7500902B2 JP7500902B2 (ja) 2024-06-18

Family

ID=84691617

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023531206A Active JP7500902B2 (ja) 2021-06-29 2021-06-29 撮像ユニット、内視鏡、および、撮像ユニットの製造方法

Country Status (4)

Country Link
US (2) US12317629B2 (https=)
JP (1) JP7500902B2 (https=)
CN (1) CN117320610A (https=)
WO (1) WO2023276006A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11831739B2 (en) * 2020-06-22 2023-11-28 Sony Semiconductor Solutions Corporation Communication apparatus and communication system
TWI811078B (zh) * 2022-08-25 2023-08-01 晉弘科技股份有限公司 內視鏡的光源影像模組及其製作方法
JP7682322B1 (ja) 2023-11-15 2025-05-23 オリンパスメディカルシステムズ株式会社 撮像ユニット、内視鏡、および、撮像ユニットの製造方法
WO2026047804A1 (ja) * 2024-08-26 2026-03-05 オリンパスメディカルシステムズ株式会社 撮像モジュールおよび内視鏡

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0485737U (https=) * 1990-11-29 1992-07-24
WO2019138462A1 (ja) * 2018-01-10 2019-07-18 オリンパス株式会社 撮像装置、内視鏡、および、撮像装置の製造方法
JP2021087032A (ja) * 2019-11-25 2021-06-03 キヤノン株式会社 モジュール、電子ビューファインダおよび撮像装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012018993A (ja) 2010-07-06 2012-01-26 Toshiba Corp カメラモジュールおよびその製造方法
JP2012042671A (ja) 2010-08-18 2012-03-01 Sharp Corp 表示装置用基板及び表示装置
DE102013224683A1 (de) 2013-12-02 2015-06-03 Digital Endoscopy Gmbh Endoskopkopf und endoskop
CN106572790B (zh) * 2014-12-08 2018-08-03 奥林巴斯株式会社 摄像单元、摄像模块和内窥镜系统
US20220382091A1 (en) * 2019-10-01 2022-12-01 Sony Group Corporation Optical compensation element, liquid-crystal display device, and electronic apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0485737U (https=) * 1990-11-29 1992-07-24
WO2019138462A1 (ja) * 2018-01-10 2019-07-18 オリンパス株式会社 撮像装置、内視鏡、および、撮像装置の製造方法
JP2021087032A (ja) * 2019-11-25 2021-06-03 キヤノン株式会社 モジュール、電子ビューファインダおよび撮像装置

Also Published As

Publication number Publication date
WO2023276006A1 (ja) 2023-01-05
US20250261471A1 (en) 2025-08-14
CN117320610A (zh) 2023-12-29
US12317629B2 (en) 2025-05-27
US20240038817A1 (en) 2024-02-01
JP7500902B2 (ja) 2024-06-18

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