JPWO2023190106A1 - - Google Patents
Info
- Publication number
- JPWO2023190106A1 JPWO2023190106A1 JP2024512316A JP2024512316A JPWO2023190106A1 JP WO2023190106 A1 JPWO2023190106 A1 JP WO2023190106A1 JP 2024512316 A JP2024512316 A JP 2024512316A JP 2024512316 A JP2024512316 A JP 2024512316A JP WO2023190106 A1 JPWO2023190106 A1 JP WO2023190106A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022060826 | 2022-03-31 | ||
| PCT/JP2023/011707 WO2023190106A1 (ja) | 2022-03-31 | 2023-03-24 | 半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023190106A1 true JPWO2023190106A1 (https=) | 2023-10-05 |
Family
ID=88202176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024512316A Pending JPWO2023190106A1 (https=) | 2022-03-31 | 2023-03-24 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2023190106A1 (https=) |
| WO (1) | WO2023190106A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2026000407A (ja) * | 2024-06-17 | 2026-01-05 | Ａｓｔｅｍｏ株式会社 | 半導体装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9299630B2 (en) * | 2012-07-30 | 2016-03-29 | General Electric Company | Diffusion barrier for surface mount modules |
| US10269688B2 (en) * | 2013-03-14 | 2019-04-23 | General Electric Company | Power overlay structure and method of making same |
-
2023
- 2023-03-24 JP JP2024512316A patent/JPWO2023190106A1/ja active Pending
- 2023-03-24 WO PCT/JP2023/011707 patent/WO2023190106A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023190106A1 (ja) | 2023-10-05 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20260317 |