JPWO2023176758A1 - - Google Patents

Info

Publication number
JPWO2023176758A1
JPWO2023176758A1 JP2024508144A JP2024508144A JPWO2023176758A1 JP WO2023176758 A1 JPWO2023176758 A1 JP WO2023176758A1 JP 2024508144 A JP2024508144 A JP 2024508144A JP 2024508144 A JP2024508144 A JP 2024508144A JP WO2023176758 A1 JPWO2023176758 A1 JP WO2023176758A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024508144A
Other languages
Japanese (ja)
Other versions
JP7651231B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023176758A1 publication Critical patent/JPWO2023176758A1/ja
Application granted granted Critical
Publication of JP7651231B2 publication Critical patent/JP7651231B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/04—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning
    • H10N30/045—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning by polarising
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H10N30/076—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H10N30/077—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H10N30/079—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing using intermediate layers, e.g. for growth control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2024508144A 2022-03-14 2023-03-13 積層構造体、電子デバイス、電子機器及びシステム Active JP7651231B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2022038743 2022-03-14
JP2022038743 2022-03-14
JP2022138842 2022-08-31
JP2022138842 2022-08-31
PCT/JP2023/009576 WO2023176758A1 (ja) 2022-03-14 2023-03-13 圧電体、積層構造体、電子デバイス、電子機器及びこれらの製造方法

Publications (2)

Publication Number Publication Date
JPWO2023176758A1 true JPWO2023176758A1 (https=) 2023-09-21
JP7651231B2 JP7651231B2 (ja) 2025-03-26

Family

ID=88023706

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024508144A Active JP7651231B2 (ja) 2022-03-14 2023-03-13 積層構造体、電子デバイス、電子機器及びシステム

Country Status (3)

Country Link
JP (1) JP7651231B2 (https=)
TW (1) TW202403073A (https=)
WO (1) WO2023176758A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004165243A (ja) * 2002-11-11 2004-06-10 Seiko Epson Corp 圧電体デバイス、液体吐出ヘッド、強誘電体デバイス及び電子機器並びにこれらの製造方法
JP2008069051A (ja) * 2006-09-15 2008-03-27 Hosokawa Funtai Gijutsu Kenkyusho:Kk 圧電セラミックス及びその製造方法
JP2008100887A (ja) * 2006-10-20 2008-05-01 Fujifilm Corp 成膜用原料粉、膜構造体及びそれらの製造方法、並びに、圧電素子
JP2018081975A (ja) * 2016-11-15 2018-05-24 株式会社ユーテック 膜構造体及びその製造方法
JP2019216181A (ja) * 2018-06-13 2019-12-19 アドバンストマテリアルテクノロジーズ株式会社 膜構造体及びその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004165243A (ja) * 2002-11-11 2004-06-10 Seiko Epson Corp 圧電体デバイス、液体吐出ヘッド、強誘電体デバイス及び電子機器並びにこれらの製造方法
JP2008069051A (ja) * 2006-09-15 2008-03-27 Hosokawa Funtai Gijutsu Kenkyusho:Kk 圧電セラミックス及びその製造方法
JP2008100887A (ja) * 2006-10-20 2008-05-01 Fujifilm Corp 成膜用原料粉、膜構造体及びそれらの製造方法、並びに、圧電素子
JP2018081975A (ja) * 2016-11-15 2018-05-24 株式会社ユーテック 膜構造体及びその製造方法
JP2019216181A (ja) * 2018-06-13 2019-12-19 アドバンストマテリアルテクノロジーズ株式会社 膜構造体及びその製造方法

Also Published As

Publication number Publication date
TW202403073A (zh) 2024-01-16
WO2023176758A1 (ja) 2023-09-21
JP7651231B2 (ja) 2025-03-26

Similar Documents

Publication Publication Date Title
JPWO2023145808A1 (https=)
CL2026000485A1 (es) Composiciones de colorantes y saborizantes alimentarios que comprenden mioglobina microencapsulada.
CL2026000375A1 (es) Métodos de conjugación de anticuerpos en fase sólida.
JPWO2024048765A1 (https=)
BR102023010976A2 (https=)
BR102023009641A2 (https=)
JPWO2023176758A1 (https=)
JPWO2023176756A1 (https=)
JPWO2023176757A1 (https=)
BY23966C1 (https=)
BY13169U (https=)
CN307046592S (https=)
CN307046412S (https=)
CN307048893S (https=)
CN307048894S (https=)
CN307046015S (https=)
CN307045566S (https=)
CN307045517S (https=)
CN307045028S (https=)
CN307044352S (https=)
CN307049516S (https=)
CN307044293S (https=)
CN307049712S (https=)
CN307049739S (https=)
BY13165U (https=)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240802

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20240802

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20241105

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20241220

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20250225

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20250306

R150 Certificate of patent or registration of utility model

Ref document number: 7651231

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150