JPWO2023162658A1 - - Google Patents
Info
- Publication number
- JPWO2023162658A1 JPWO2023162658A1 JP2024502979A JP2024502979A JPWO2023162658A1 JP WO2023162658 A1 JPWO2023162658 A1 JP WO2023162658A1 JP 2024502979 A JP2024502979 A JP 2024502979A JP 2024502979 A JP2024502979 A JP 2024502979A JP WO2023162658 A1 JPWO2023162658 A1 JP WO2023162658A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/092—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by backside coating or layers, by lubricating-slip layers or means, by oxygen barrier layers or by stripping-release layers or means
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
- G03F7/0043—Chalcogenides; Silicon, germanium, arsenic or derivatives thereof; Metals, oxides or alloys thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Metallurgy (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022030209 | 2022-02-28 | ||
| JP2022116675 | 2022-07-21 | ||
| PCT/JP2023/003878 WO2023162658A1 (ja) | 2022-02-28 | 2023-02-06 | メタマテリアル及び積層体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023162658A1 true JPWO2023162658A1 (https=) | 2023-08-31 |
| JPWO2023162658A5 JPWO2023162658A5 (https=) | 2024-11-06 |
Family
ID=87765674
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024502979A Pending JPWO2023162658A1 (https=) | 2022-02-28 | 2023-02-06 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20240402597A1 (https=) |
| JP (1) | JPWO2023162658A1 (https=) |
| WO (1) | WO2023162658A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5217494B2 (ja) * | 2007-05-08 | 2013-06-19 | 旭硝子株式会社 | 人工媒質、その製造方法およびアンテナ装置 |
| JP6169546B2 (ja) * | 2014-09-11 | 2017-07-26 | 日本電信電話株式会社 | 誘電分光センサ、誘電分光センサを用いた測定システムおよび誘電分光センサを用いた測定方法 |
| JP7720707B2 (ja) * | 2020-03-31 | 2025-08-08 | 日鉄ケミカル＆マテリアル株式会社 | ポリイミド、架橋ポリイミド、接着剤フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板、回路基板及び多層回路基板 |
-
2023
- 2023-02-06 WO PCT/JP2023/003878 patent/WO2023162658A1/ja not_active Ceased
- 2023-02-06 JP JP2024502979A patent/JPWO2023162658A1/ja active Pending
-
2024
- 2024-08-15 US US18/805,543 patent/US20240402597A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20240402597A1 (en) | 2024-12-05 |
| WO2023162658A1 (ja) | 2023-08-31 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240805 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20260108 |