JPWO2023157206A1 - - Google Patents
Info
- Publication number
- JPWO2023157206A1 JPWO2023157206A1 JP2022536479A JP2022536479A JPWO2023157206A1 JP WO2023157206 A1 JPWO2023157206 A1 JP WO2023157206A1 JP 2022536479 A JP2022536479 A JP 2022536479A JP 2022536479 A JP2022536479 A JP 2022536479A JP WO2023157206 A1 JPWO2023157206 A1 JP WO2023157206A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/006516 WO2023157206A1 (ja) | 2022-02-18 | 2022-02-18 | 電子装置及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP7165374B1 JP7165374B1 (ja) | 2022-11-04 |
| JPWO2023157206A1 true JPWO2023157206A1 (ja) | 2023-08-24 |
| JPWO2023157206A5 JPWO2023157206A5 (ja) | 2024-01-23 |
Family
ID=83897806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022536479A Active JP7165374B1 (ja) | 2022-02-18 | 2022-02-18 | 電子装置及びその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7165374B1 (ja) |
| WO (1) | WO2023157206A1 (ja) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5167801B2 (ja) * | 2007-12-25 | 2013-03-21 | 富士通株式会社 | 配線基板および配線基板の製造方法 |
| WO2011040393A1 (ja) * | 2009-09-30 | 2011-04-07 | 株式会社村田製作所 | 回路基板及びその製造方法 |
| JP2018116959A (ja) * | 2017-01-16 | 2018-07-26 | 日立化成株式会社 | 回路基板装置 |
-
2022
- 2022-02-18 JP JP2022536479A patent/JP7165374B1/ja active Active
- 2022-02-18 WO PCT/JP2022/006516 patent/WO2023157206A1/ja active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023157206A1 (ja) | 2023-08-24 |
| JP7165374B1 (ja) | 2022-11-04 |
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