JPWO2023152908A1 - - Google Patents

Info

Publication number
JPWO2023152908A1
JPWO2023152908A1 JP2023579985A JP2023579985A JPWO2023152908A1 JP WO2023152908 A1 JPWO2023152908 A1 JP WO2023152908A1 JP 2023579985 A JP2023579985 A JP 2023579985A JP 2023579985 A JP2023579985 A JP 2023579985A JP WO2023152908 A1 JPWO2023152908 A1 JP WO2023152908A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023579985A
Other languages
Japanese (ja)
Other versions
JPWO2023152908A5 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023152908A1 publication Critical patent/JPWO2023152908A1/ja
Publication of JPWO2023152908A5 publication Critical patent/JPWO2023152908A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
JP2023579985A 2022-02-10 2022-02-10 Pending JPWO2023152908A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/005460 WO2023152908A1 (en) 2022-02-10 2022-02-10 Vertical vibration device, vertical vibration method, component supply device, component supply method, and screen printing device

Publications (2)

Publication Number Publication Date
JPWO2023152908A1 true JPWO2023152908A1 (en) 2023-08-17
JPWO2023152908A5 JPWO2023152908A5 (en) 2024-04-15

Family

ID=87563956

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023579985A Pending JPWO2023152908A1 (en) 2022-02-10 2022-02-10

Country Status (3)

Country Link
JP (1) JPWO2023152908A1 (en)
TW (1) TW202332593A (en)
WO (1) WO2023152908A1 (en)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0878829A (en) * 1994-09-09 1996-03-22 Hitachi Ltd Solder feeding method of surface-mounting printed board
JP3586334B2 (en) * 1996-04-05 2004-11-10 新日本製鐵株式会社 Ball jumping device
JP2000243872A (en) * 1999-02-22 2000-09-08 Sony Corp Semiconductor device and its manufacture
JP4439708B2 (en) * 2000-10-10 2010-03-24 新日鉄マテリアルズ株式会社 Method and apparatus for sucking and arranging conductive balls
JP2003273161A (en) * 2002-03-13 2003-09-26 Sekisui Chem Co Ltd Manufacturing device for conductive particle arrangement film
JP2010067893A (en) * 2008-09-12 2010-03-25 Athlete Fa Kk Ball loading device
JP5202353B2 (en) * 2009-01-21 2013-06-05 新光電気工業株式会社 Conductive ball mounting method and apparatus
KR102406310B1 (en) * 2018-10-31 2022-06-13 마이크로·텍 가부시끼가이샤 Vibration device, vibration method, and vibration transfer device

Also Published As

Publication number Publication date
WO2023152908A1 (en) 2023-08-17
TW202332593A (en) 2023-08-16

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Legal Events

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Effective date: 20240116

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Effective date: 20240116