JPWO2023144928A5 - - Google Patents
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- JPWO2023144928A5 JPWO2023144928A5 JP2022536634A JP2022536634A JPWO2023144928A5 JP WO2023144928 A5 JPWO2023144928 A5 JP WO2023144928A5 JP 2022536634 A JP2022536634 A JP 2022536634A JP 2022536634 A JP2022536634 A JP 2022536634A JP WO2023144928 A5 JPWO2023144928 A5 JP WO2023144928A5
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- JP
- Japan
- Prior art keywords
- polycarbonate resin
- resin composition
- compound
- weight
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 150000001875 compounds Chemical class 0.000 claims 8
- 229920005668 polycarbonate resin Polymers 0.000 claims 7
- 239000004431 polycarbonate resin Substances 0.000 claims 7
- 239000000203 mixture Substances 0.000 claims 5
- 239000002608 ionic liquid Substances 0.000 claims 3
- 150000004714 phosphonium salts Chemical class 0.000 claims 3
- 229920001296 polysiloxane Polymers 0.000 claims 3
- 239000000126 substance Substances 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 claims 2
- ZXMGHDIOOHOAAE-UHFFFAOYSA-N 1,1,1-trifluoro-n-(trifluoromethylsulfonyl)methanesulfonamide Chemical compound FC(F)(F)S(=O)(=O)NS(=O)(=O)C(F)(F)F ZXMGHDIOOHOAAE-UHFFFAOYSA-N 0.000 claims 1
- 125000003545 alkoxy group Chemical group 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- 125000004104 aryloxy group Chemical group 0.000 claims 1
- VBVCYAZECWLFHP-UHFFFAOYSA-N dodecyl benzenesulfonate;tetrabutylphosphanium Chemical compound CCCC[P+](CCCC)(CCCC)CCCC.CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 VBVCYAZECWLFHP-UHFFFAOYSA-N 0.000 claims 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- 238000004898 kneading Methods 0.000 claims 1
- 238000002834 transmittance Methods 0.000 claims 1
- SNDRYHUSDCHSDJ-UHFFFAOYSA-N tributyl(dodecyl)phosphanium Chemical compound CCCCCCCCCCCC[P+](CCCC)(CCCC)CCCC SNDRYHUSDCHSDJ-UHFFFAOYSA-N 0.000 claims 1
- ABJGUZZWSKMTEI-UHFFFAOYSA-M tributyl(dodecyl)phosphanium;bromide Chemical compound [Br-].CCCCCCCCCCCC[P+](CCCC)(CCCC)CCCC ABJGUZZWSKMTEI-UHFFFAOYSA-M 0.000 claims 1
Claims (4)
シリコーン系化合物1.0~3.0重量部およびホスホニウム塩系イオン液体0.5~3.0重量部のうち少なくとも1種を含有し、
前記ドナーアクセプター系化合物が、下記化学式1で表される化合物であり、
前記シリコーン系化合物が、下記化学式2で表される化合物であり、25℃における動粘度が10~20000mm 2 /secであり、
前記ホスホニウム塩系イオン液体が、トリブチルドデシルホスホニウムビス(トリフルオロメタンスルホニル)イミド、トリブチルドデシルホスホニウムブロミドおよびドデシルベンゼンスルホン酸テトラブチルホスホニウムからなる群から選択される少なくとも1種を含む、ポリカーボネート樹脂組成物。
前記化学式2中、
R 1 およびR 2 は、それぞれ独立して、水素原子、アルキル基、アルコキシ基、アリール基またはアリールオキシ基である。 Containing 100 parts by weight of a polycarbonate resin and 0.5 to 3.0 parts by weight of a donor-acceptor compound,
Containing at least one of 1.0 to 3.0 parts by weight of a silicone compound and 0.5 to 3.0 parts by weight of a phosphonium salt-based ionic liquid ,
The donor-acceptor compound is a compound represented by the following chemical formula 1,
The silicone compound is a compound represented by the following chemical formula 2, and has a kinematic viscosity of 10 to 20000 mm 2 /sec at 25°C,
A polycarbonate resin composition, wherein the phosphonium salt-based ionic liquid contains at least one selected from the group consisting of tributyldodecylphosphonium bis(trifluoromethanesulfonyl)imide, tributyldodecylphosphonium bromide, and tetrabutylphosphonium dodecylbenzenesulfonate.
In the chemical formula 2,
R 1 and R 2 are each independently a hydrogen atom, an alkyl group, an alkoxy group, an aryl group or an aryloxy group.
ポリカーボネート樹脂と、ドナーアクセプター系化合物と、シリコーン系化合物およびホスホニウム塩系イオン液体のうち少なくとも1種とを溶融混練して得る、ポリカーボネート樹脂組成物の製造方法。 A method for producing a polycarbonate resin composition according to claim 1 or 2 , comprising:
A method for producing a polycarbonate resin composition, which is obtained by melt-kneading a polycarbonate resin, a donor-acceptor compound, and at least one of a silicone compound and a phosphonium salt ionic liquid.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2022/002888 WO2023144928A1 (en) | 2022-01-26 | 2022-01-26 | Polycarbonate resin composition, molded product, and production method for polycarbonate resin composition |
Publications (3)
Publication Number | Publication Date |
---|---|
JP7170946B1 JP7170946B1 (en) | 2022-11-14 |
JPWO2023144928A1 JPWO2023144928A1 (en) | 2023-08-03 |
JPWO2023144928A5 true JPWO2023144928A5 (en) | 2023-12-26 |
Family
ID=84027178
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022536634A Active JP7170946B1 (en) | 2022-01-26 | 2022-01-26 | Polycarbonate resin composition, molded article, and method for producing polycarbonate resin composition |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP7170946B1 (en) |
WO (1) | WO2023144928A1 (en) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5460189B2 (en) * | 2009-09-07 | 2014-04-02 | 住化スタイロンポリカーボネート株式会社 | Antistatic polycarbonate resin composition |
JP5734491B1 (en) * | 2014-04-10 | 2015-06-17 | 株式会社ボロン研究所 | Molded product comprising antistatic agent and insulator polymer material and method for producing the same |
JP2020033561A (en) * | 2018-08-28 | 2020-03-05 | 積水化学工業株式会社 | Adhesive tape and film |
JP7457483B2 (en) * | 2019-10-30 | 2024-03-28 | 三菱瓦斯化学株式会社 | Composition, sheet, security card, and method for producing the composition |
-
2022
- 2022-01-26 WO PCT/JP2022/002888 patent/WO2023144928A1/en active Application Filing
- 2022-01-26 JP JP2022536634A patent/JP7170946B1/en active Active
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