JPWO2023127130A1 - - Google Patents

Info

Publication number
JPWO2023127130A1
JPWO2023127130A1 JP2023570606A JP2023570606A JPWO2023127130A1 JP WO2023127130 A1 JPWO2023127130 A1 JP WO2023127130A1 JP 2023570606 A JP2023570606 A JP 2023570606A JP 2023570606 A JP2023570606 A JP 2023570606A JP WO2023127130 A1 JPWO2023127130 A1 JP WO2023127130A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023570606A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023127130A1 publication Critical patent/JPWO2023127130A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Ceramic Products (AREA)
  • Die Bonding (AREA)
JP2023570606A 2021-12-28 2021-12-28 Pending JPWO2023127130A1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/048880 WO2023127130A1 (ja) 2021-12-28 2021-12-28 半導体装置及びその製造方法

Publications (1)

Publication Number Publication Date
JPWO2023127130A1 true JPWO2023127130A1 (ja) 2023-07-06

Family

ID=86998432

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023570606A Pending JPWO2023127130A1 (ja) 2021-12-28 2021-12-28

Country Status (2)

Country Link
JP (1) JPWO2023127130A1 (ja)
WO (1) WO2023127130A1 (ja)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08191120A (ja) * 1995-01-10 1996-07-23 Hitachi Ltd パワー半導体素子用基板とその製造方法
JP3871599B2 (ja) * 2002-04-05 2007-01-24 電気化学工業株式会社 構造物
WO2016017689A1 (ja) * 2014-07-31 2016-02-04 電気化学工業株式会社 アルミニウム‐炭化珪素質複合体及びその製造方法
JP2021004668A (ja) * 2019-06-27 2021-01-14 京セラ株式会社 流路部材

Also Published As

Publication number Publication date
WO2023127130A1 (ja) 2023-07-06

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20231211