JPWO2023119805A1 - - Google Patents
Info
- Publication number
- JPWO2023119805A1 JPWO2023119805A1 JP2023569086A JP2023569086A JPWO2023119805A1 JP WO2023119805 A1 JPWO2023119805 A1 JP WO2023119805A1 JP 2023569086 A JP2023569086 A JP 2023569086A JP 2023569086 A JP2023569086 A JP 2023569086A JP WO2023119805 A1 JPWO2023119805 A1 JP WO2023119805A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/48—Polymers modified by chemical after-treatment
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021210991 | 2021-12-24 | ||
| PCT/JP2022/038224 WO2023119805A1 (ja) | 2021-12-24 | 2022-10-13 | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023119805A1 true JPWO2023119805A1 (https=) | 2023-06-29 |
Family
ID=86901950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023569086A Pending JPWO2023119805A1 (https=) | 2021-12-24 | 2022-10-13 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2023119805A1 (https=) |
| TW (1) | TW202325793A (https=) |
| WO (1) | WO2023119805A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024057803A1 (ja) * | 2022-09-16 | 2024-03-21 | パナソニックＩｐマネジメント株式会社 | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板 |
| JP7517582B1 (ja) * | 2023-12-19 | 2024-07-17 | Dic株式会社 | 樹脂組成物、シート、金属ベース基板 |
| WO2025229908A1 (ja) * | 2024-04-30 | 2025-11-06 | パナソニックＩｐマネジメント株式会社 | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板 |
| WO2025229977A1 (ja) * | 2024-05-02 | 2025-11-06 | 太陽ホールディングス株式会社 | 硬化性組成物、硬化物、及び、電子部品 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6906171B2 (ja) * | 2016-01-19 | 2021-07-21 | パナソニックＩｐマネジメント株式会社 | ポリフェニレンエーテル樹脂組成物、プリプレグ、金属張積層板及びプリント配線板 |
| US11312858B2 (en) * | 2017-07-12 | 2022-04-26 | Panasonic Intellectual Property Management Co., Ltd. | Resin composition, prepreg, film including resin, metal foil including resin, metal-clad laminate, and wiring board |
| EP3786230B1 (en) * | 2018-04-27 | 2024-09-18 | Mitsubishi Gas Chemical Company, Inc. | Thermosetting composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board |
| JP2021004316A (ja) * | 2019-06-26 | 2021-01-14 | パナソニックＩｐマネジメント株式会社 | 樹脂組成物、プリプレグ、プリプレグの製造方法、積層板及びプリント配線板 |
| JPWO2021059911A1 (https=) * | 2019-09-27 | 2021-04-01 | ||
| WO2022014584A1 (ja) * | 2020-07-17 | 2022-01-20 | パナソニックＩｐマネジメント株式会社 | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板 |
| WO2022014582A1 (ja) * | 2020-07-17 | 2022-01-20 | パナソニックＩｐマネジメント株式会社 | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板 |
| CN112111074B (zh) * | 2020-09-28 | 2023-08-18 | 常州中英科技股份有限公司 | 一种可交联碳氢树脂组合物的均匀分散液及其制备的半固化片和高导热热固型覆铜板 |
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2022
- 2022-10-11 TW TW111138420A patent/TW202325793A/zh unknown
- 2022-10-13 WO PCT/JP2022/038224 patent/WO2023119805A1/ja not_active Ceased
- 2022-10-13 JP JP2023569086A patent/JPWO2023119805A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023119805A1 (ja) | 2023-06-29 |
| TW202325793A (zh) | 2023-07-01 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250804 |