JPWO2023106086A1 - - Google Patents

Info

Publication number
JPWO2023106086A1
JPWO2023106086A1 JP2023566211A JP2023566211A JPWO2023106086A1 JP WO2023106086 A1 JPWO2023106086 A1 JP WO2023106086A1 JP 2023566211 A JP2023566211 A JP 2023566211A JP 2023566211 A JP2023566211 A JP 2023566211A JP WO2023106086 A1 JPWO2023106086 A1 JP WO2023106086A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023566211A
Other languages
Japanese (ja)
Other versions
JPWO2023106086A5 (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023106086A1 publication Critical patent/JPWO2023106086A1/ja
Publication of JPWO2023106086A5 publication Critical patent/JPWO2023106086A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Drying Of Semiconductors (AREA)
JP2023566211A 2021-12-06 2022-11-22 Pending JPWO2023106086A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021198041 2021-12-06
PCT/JP2022/043161 WO2023106086A1 (ja) 2021-12-06 2022-11-22 基板処理方法及び基板処理システム

Publications (2)

Publication Number Publication Date
JPWO2023106086A1 true JPWO2023106086A1 (zh) 2023-06-15
JPWO2023106086A5 JPWO2023106086A5 (zh) 2024-08-07

Family

ID=86730298

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023566211A Pending JPWO2023106086A1 (zh) 2021-12-06 2022-11-22

Country Status (3)

Country Link
JP (1) JPWO2023106086A1 (zh)
TW (1) TW202326836A (zh)
WO (1) WO2023106086A1 (zh)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7141892B2 (ja) * 2018-09-03 2022-09-26 株式会社プレテック エッチング装置及びエッチング方法
JP7376317B2 (ja) * 2019-10-30 2023-11-08 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
JP7542417B2 (ja) * 2019-12-27 2024-08-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、基板処理方法、基板処理システム、及び学習用データの生成方法
JP7460411B2 (ja) * 2020-03-24 2024-04-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置及び基板処理方法
JP2022162709A (ja) * 2021-04-13 2022-10-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、基板処理システム、及びデータ処理方法

Also Published As

Publication number Publication date
WO2023106086A1 (ja) 2023-06-15
TW202326836A (zh) 2023-07-01

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Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240523

A621 Written request for application examination

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Effective date: 20240523