JPWO2023105747A1 - - Google Patents
Info
- Publication number
- JPWO2023105747A1 JPWO2023105747A1 JP2023565836A JP2023565836A JPWO2023105747A1 JP WO2023105747 A1 JPWO2023105747 A1 JP WO2023105747A1 JP 2023565836 A JP2023565836 A JP 2023565836A JP 2023565836 A JP2023565836 A JP 2023565836A JP WO2023105747 A1 JPWO2023105747 A1 JP WO2023105747A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
- C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/045506 WO2023105747A1 (ja) | 2021-12-10 | 2021-12-10 | ニッケルめっき液、及び、ニッケルまたはニッケル合金めっき皮膜の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023105747A1 true JPWO2023105747A1 (https=) | 2023-06-15 |
| JPWO2023105747A5 JPWO2023105747A5 (https=) | 2024-08-20 |
| JP7736811B2 JP7736811B2 (ja) | 2025-09-09 |
Family
ID=86729973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023565836A Active JP7736811B2 (ja) | 2021-12-10 | 2021-12-10 | ニッケルめっき液、及び、ニッケルまたはニッケル合金めっき皮膜の製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7736811B2 (https=) |
| CN (1) | CN118284719A (https=) |
| WO (1) | WO2023105747A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119776921A (zh) * | 2024-12-26 | 2025-04-08 | 广东韶配动力机械有限公司 | 一种纳米硬铬促进剂及其制备方法和应用 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010279959A (ja) * | 2009-06-02 | 2010-12-16 | Mishima Kosan Co Ltd | 連続鋳造用鋳型 |
| JP2013241649A (ja) * | 2012-05-21 | 2013-12-05 | Kanto Gakuin | 複合めっき液、複合めっき液の製造方法、及び積層体 |
| WO2016013219A1 (ja) * | 2014-07-23 | 2016-01-28 | 日本ゼオン株式会社 | めっき液およびその製造方法、並びに、複合材料、銅複合材料およびその製造方法 |
| WO2017099250A1 (ja) * | 2015-12-11 | 2017-06-15 | 国立大学法人豊橋技術科学大学 | 粉末粒子及びこれを用いたグリーン体の製造方法 |
-
2021
- 2021-12-10 CN CN202180104420.2A patent/CN118284719A/zh active Pending
- 2021-12-10 WO PCT/JP2021/045506 patent/WO2023105747A1/ja not_active Ceased
- 2021-12-10 JP JP2023565836A patent/JP7736811B2/ja active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010279959A (ja) * | 2009-06-02 | 2010-12-16 | Mishima Kosan Co Ltd | 連続鋳造用鋳型 |
| JP2013241649A (ja) * | 2012-05-21 | 2013-12-05 | Kanto Gakuin | 複合めっき液、複合めっき液の製造方法、及び積層体 |
| WO2016013219A1 (ja) * | 2014-07-23 | 2016-01-28 | 日本ゼオン株式会社 | めっき液およびその製造方法、並びに、複合材料、銅複合材料およびその製造方法 |
| WO2017099250A1 (ja) * | 2015-12-11 | 2017-06-15 | 国立大学法人豊橋技術科学大学 | 粉末粒子及びこれを用いたグリーン体の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023105747A1 (ja) | 2023-06-15 |
| CN118284719A (zh) | 2024-07-02 |
| JP7736811B2 (ja) | 2025-09-09 |
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