JPWO2023074633A1 - - Google Patents

Info

Publication number
JPWO2023074633A1
JPWO2023074633A1 JP2023556433A JP2023556433A JPWO2023074633A1 JP WO2023074633 A1 JPWO2023074633 A1 JP WO2023074633A1 JP 2023556433 A JP2023556433 A JP 2023556433A JP 2023556433 A JP2023556433 A JP 2023556433A JP WO2023074633 A1 JPWO2023074633 A1 JP WO2023074633A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023556433A
Other languages
Japanese (ja)
Other versions
JPWO2023074633A5 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023074633A1 publication Critical patent/JPWO2023074633A1/ja
Publication of JPWO2023074633A5 publication Critical patent/JPWO2023074633A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/24—After-treatment of workpieces or articles
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/05—Mixtures of metal powder with non-metallic powder
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2023556433A 2021-10-29 2022-10-24 Pending JPWO2023074633A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021177306 2021-10-29
PCT/JP2022/039554 WO2023074633A1 (en) 2021-10-29 2022-10-24 Heat dissipation member and electronic device

Publications (2)

Publication Number Publication Date
JPWO2023074633A1 true JPWO2023074633A1 (en) 2023-05-04
JPWO2023074633A5 JPWO2023074633A5 (en) 2024-05-24

Family

ID=86157840

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023556433A Pending JPWO2023074633A1 (en) 2021-10-29 2022-10-24

Country Status (2)

Country Link
JP (1) JPWO2023074633A1 (en)
WO (1) WO2023074633A1 (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4148123B2 (en) * 2003-12-08 2008-09-10 三菱マテリアル株式会社 Radiator and power module
EP1976004B1 (en) * 2005-12-28 2017-02-15 A.L.M.T. Corp. Semiconductor element mounting substrate, semiconductor device using the same, and process for producing semiconductor element mounting substrate
JP2013098491A (en) * 2011-11-04 2013-05-20 Sumitomo Electric Ind Ltd Heat sink, method of manufacturing heat sink, semiconductor device and semiconductor module
JP6429108B2 (en) * 2013-10-16 2018-11-28 株式会社アライドマテリアル Semiconductor element mounting substrate and semiconductor element device using the same
JP7101754B2 (en) * 2018-02-14 2022-07-15 住友電気工業株式会社 Composite member and manufacturing method of composite member
JP2021168376A (en) * 2020-01-31 2021-10-21 日亜化学工業株式会社 Method of manufacturing heat dissipation substrate and method of manufacturing composite substrate

Also Published As

Publication number Publication date
WO2023074633A1 (en) 2023-05-04

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Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240229

A621 Written request for application examination

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Effective date: 20240229