JPWO2023068314A5 - - Google Patents
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- Publication number
- JPWO2023068314A5 JPWO2023068314A5 JP2022567139A JP2022567139A JPWO2023068314A5 JP WO2023068314 A5 JPWO2023068314 A5 JP WO2023068314A5 JP 2022567139 A JP2022567139 A JP 2022567139A JP 2022567139 A JP2022567139 A JP 2022567139A JP WO2023068314 A5 JPWO2023068314 A5 JP WO2023068314A5
- Authority
- JP
- Japan
- Prior art keywords
- adhesive tape
- tape according
- meth
- adhesive layer
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002390 adhesive tape Substances 0.000 claims 15
- 239000012790 adhesive layer Substances 0.000 claims 10
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims 6
- 230000009477 glass transition Effects 0.000 claims 6
- 229920001519 homopolymer Polymers 0.000 claims 5
- 229920000058 polyacrylate Polymers 0.000 claims 4
- 125000000217 alkyl group Chemical group 0.000 claims 3
- 125000004432 carbon atom Chemical group C* 0.000 claims 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims 1
- 239000003431 cross linking reagent Substances 0.000 claims 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 239000012948 isocyanate Substances 0.000 claims 1
- 150000002513 isocyanates Chemical class 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000000178 monomer Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Claims (14)
前記粘着剤層のボールタックがＮｏ１２以下であり、
前記粘着剤層の厚みｔ（μｍ）と、前記粘着剤層の２３℃、１Ｈｚでのせん断貯蔵弾性率Ｇ’（ｋＰａ）との比ｔ／Ｇ’が１以上であり、
部品を転写する工程において、前記部品を受け止めるために用いられる
ことを特徴とする粘着テープ。 An adhesive tape having an adhesive layer,
The ball tack of the adhesive layer is No. 12 or less,
The ratio t/G' between the thickness t (μm) of the adhesive layer and the shear storage modulus G' (kPa) at 23° C. and 1 Hz of the adhesive layer is 1 or more,
Used to receive the parts in the process of transferring parts.
An adhesive tape characterized by:
ｙ≧－１３．３６６（ｔ／Ｇ’）＋２８．９４ （１） The adhesive tape according to claim 1, wherein the following formula (1) is satisfied when the ball tack number of the adhesive layer is y.
y≧-13.366 (t/G')+28.94 (1)
ｙ≧－１１．９８１（ｔ／Ｇ’）＋４１．５２８ （２） The adhesive tape according to claim 2, wherein the following formula (2) is satisfied when the ball tack number of the adhesive layer is y.
y≧-11.981(t/G')+41.528 (2)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021172625 | 2021-10-21 | ||
| JP2021172625 | 2021-10-21 | ||
| JP2021214308 | 2021-12-28 | ||
| JP2021214308 | 2021-12-28 | ||
| PCT/JP2022/039017 WO2023068314A1 (en) | 2021-10-21 | 2022-10-20 | Pressure-sensitive adhesive tape |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023068314A1 JPWO2023068314A1 (en) | 2023-04-27 |
| JPWO2023068314A5 true JPWO2023068314A5 (en) | 2023-12-04 |
| JP7476351B2 JP7476351B2 (en) | 2024-04-30 |
Family
ID=86058281
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022567139A Active JP7476351B2 (en) | 2021-10-21 | 2022-10-20 | Adhesive tape |
| JP2022573480A Pending JPWO2023068315A1 (en) | 2021-10-21 | 2022-10-20 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022573480A Pending JPWO2023068315A1 (en) | 2021-10-21 | 2022-10-20 |
Country Status (3)
| Country | Link |
|---|---|
| JP (2) | JP7476351B2 (en) |
| TW (2) | TW202330849A (en) |
| WO (2) | WO2023068314A1 (en) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2806592B2 (en) * | 1990-02-14 | 1998-09-30 | 積水化学工業株式会社 | Acrylic adhesive composition, adhesive tape, adhesive label or adhesive sheet |
| JP2011116916A (en) | 2009-12-07 | 2011-06-16 | Daio Paper Corp | Adhesive agent composition and adhesive sheet |
| JP2013173913A (en) * | 2011-11-10 | 2013-09-05 | Nitto Denko Corp | Method of detaching plates |
| JP2013159760A (en) * | 2012-02-08 | 2013-08-19 | Daio Paper Corp | Thermally-conductive adhesive sheet |
| EP3170874B1 (en) | 2014-07-14 | 2019-04-10 | Denka Company Limited | Polyvinylidene fluoride resin adhesive film |
| GB2544335A (en) * | 2015-11-13 | 2017-05-17 | Oculus Vr Llc | A method and apparatus for use in the manufacture of a display element |
| JP6800062B2 (en) * | 2017-03-28 | 2020-12-16 | 古河電気工業株式会社 | Adhesive tape |
| JP6757479B2 (en) * | 2019-01-30 | 2020-09-16 | 日東電工株式会社 | Adhesive sheets, optical films with adhesive layers, laminates, and image displays |
| KR102554028B1 (en) * | 2019-02-07 | 2023-07-11 | (주)이녹스첨단소재 | Pressure Sensitive Adhesive composition using foldable display |
| JP2022116798A (en) * | 2021-01-29 | 2022-08-10 | 日東電工株式会社 | Adhesive sheet for electronic component transfer and method for processing electronic component using adhesive sheet for electronic component transfer |
-
2022
- 2022-10-20 WO PCT/JP2022/039017 patent/WO2023068314A1/en active Application Filing
- 2022-10-20 JP JP2022567139A patent/JP7476351B2/en active Active
- 2022-10-20 JP JP2022573480A patent/JPWO2023068315A1/ja active Pending
- 2022-10-20 WO PCT/JP2022/039020 patent/WO2023068315A1/en active Application Filing
- 2022-10-20 TW TW111139866A patent/TW202330849A/en unknown
- 2022-10-20 TW TW111139867A patent/TW202334358A/en unknown
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