JPWO2023063267A1 - - Google Patents
Info
- Publication number
- JPWO2023063267A1 JPWO2023063267A1 JP2022580898A JP2022580898A JPWO2023063267A1 JP WO2023063267 A1 JPWO2023063267 A1 JP WO2023063267A1 JP 2022580898 A JP2022580898 A JP 2022580898A JP 2022580898 A JP2022580898 A JP 2022580898A JP WO2023063267 A1 JPWO2023063267 A1 JP WO2023063267A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021169332 | 2021-10-15 | ||
| JP2021169332 | 2021-10-15 | ||
| PCT/JP2022/037693 WO2023063267A1 (en) | 2021-10-15 | 2022-10-07 | Maleimide resin mixture for sealing materials, maleimide resin composition and cured product of same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023063267A1 true JPWO2023063267A1 (en) | 2023-04-20 |
| JP7281246B1 JP7281246B1 (en) | 2023-05-25 |
| JPWO2023063267A5 JPWO2023063267A5 (en) | 2023-09-21 |
Family
ID=85987722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022580898A Active JP7281246B1 (en) | 2021-10-15 | 2022-10-07 | Maleimide resin mixture for sealing material, maleimide resin composition and cured product thereof |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7281246B1 (en) |
| CN (1) | CN118103430A (en) |
| TW (1) | TW202330655A (en) |
| WO (1) | WO2023063267A1 (en) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5030297B2 (en) * | 2007-05-18 | 2012-09-19 | 日本化薬株式会社 | Laminate resin composition, prepreg and laminate |
| US20130261260A1 (en) * | 2010-12-27 | 2013-10-03 | Mitsubishi Gas Chemical Company, Inc. | Thermosetting resin composition |
| US9480164B2 (en) * | 2011-05-31 | 2016-10-25 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg, and laminate |
| JP2018104683A (en) * | 2016-12-22 | 2018-07-05 | 京セラ株式会社 | Composition for sealing molding material and electronic component device |
| JP7026887B2 (en) * | 2018-04-25 | 2022-03-01 | 三菱瓦斯化学株式会社 | Resin composition, cured product, single-layer resin sheet, laminated resin sheet, prepreg, metal leaf-clad laminated board, printed wiring board, sealing material, fiber-reinforced composite material and adhesive |
| WO2020161926A1 (en) * | 2019-02-05 | 2020-08-13 | 株式会社プリンテック | Resin composition and method for producing same |
| CN111621152A (en) * | 2019-02-28 | 2020-09-04 | 京瓷株式会社 | Molding material composition for sealing element and electronic component device |
| KR20220157933A (en) * | 2020-03-25 | 2022-11-29 | 미츠비시 가스 가가쿠 가부시키가이샤 | Resin compositions, prepregs, resin sheets, laminates, metal foil-clad laminates, and printed wiring boards |
-
2022
- 2022-10-07 CN CN202280069008.6A patent/CN118103430A/en active Pending
- 2022-10-07 JP JP2022580898A patent/JP7281246B1/en active Active
- 2022-10-07 WO PCT/JP2022/037693 patent/WO2023063267A1/en active Application Filing
- 2022-10-14 TW TW111139106A patent/TW202330655A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP7281246B1 (en) | 2023-05-25 |
| WO2023063267A1 (en) | 2023-04-20 |
| TW202330655A (en) | 2023-08-01 |
| CN118103430A (en) | 2024-05-28 |
Similar Documents
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