JPWO2023058437A1 - - Google Patents
Info
- Publication number
- JPWO2023058437A1 JPWO2023058437A1 JP2023552784A JP2023552784A JPWO2023058437A1 JP WO2023058437 A1 JPWO2023058437 A1 JP WO2023058437A1 JP 2023552784 A JP2023552784 A JP 2023552784A JP 2023552784 A JP2023552784 A JP 2023552784A JP WO2023058437 A1 JPWO2023058437 A1 JP WO2023058437A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021166103 | 2021-10-08 | ||
PCT/JP2022/034700 WO2023058437A1 (en) | 2021-10-08 | 2022-09-16 | Semiconductor device, power conversion device, and manufacturing method for semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2023058437A1 true JPWO2023058437A1 (en) | 2023-04-13 |
JPWO2023058437A5 JPWO2023058437A5 (en) | 2023-12-28 |
Family
ID=85804211
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023552784A Pending JPWO2023058437A1 (en) | 2021-10-08 | 2022-09-16 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPWO2023058437A1 (en) |
WO (1) | WO2023058437A1 (en) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2731123B2 (en) * | 1995-03-08 | 1998-03-25 | 三洋電機株式会社 | Semiconductor device and manufacturing method thereof |
JPH09213846A (en) * | 1996-01-31 | 1997-08-15 | Sanyo Electric Co Ltd | Semiconductor device |
JP2001035985A (en) * | 1999-07-19 | 2001-02-09 | Denso Corp | Semiconductor device sealed with resin |
DE112014006660B4 (en) * | 2014-05-12 | 2019-10-31 | Mitsubishi Electric Corporation | Power semiconductor device and method of manufacturing the same |
JP7059765B2 (en) * | 2018-04-06 | 2022-04-26 | 株式会社デンソー | Semiconductor device |
JP7019809B2 (en) * | 2018-06-13 | 2022-02-15 | 三菱電機株式会社 | Power semiconductor devices |
WO2020246456A1 (en) * | 2019-06-03 | 2020-12-10 | 三菱電機株式会社 | Semiconductor device and power conversion device |
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2022
- 2022-09-16 JP JP2023552784A patent/JPWO2023058437A1/ja active Pending
- 2022-09-16 WO PCT/JP2022/034700 patent/WO2023058437A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2023058437A1 (en) | 2023-04-13 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230922 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230922 |