JPWO2023048098A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2023048098A5
JPWO2023048098A5 JP2023508073A JP2023508073A JPWO2023048098A5 JP WO2023048098 A5 JPWO2023048098 A5 JP WO2023048098A5 JP 2023508073 A JP2023508073 A JP 2023508073A JP 2023508073 A JP2023508073 A JP 2023508073A JP WO2023048098 A5 JPWO2023048098 A5 JP WO2023048098A5
Authority
JP
Japan
Prior art keywords
conductive paste
sintering
formula
particles
silver
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023508073A
Other languages
Japanese (ja)
Other versions
JPWO2023048098A1 (en
JP7260079B1 (en
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/034825 external-priority patent/WO2023048098A1/en
Publication of JPWO2023048098A1 publication Critical patent/JPWO2023048098A1/ja
Priority to JP2023060303A priority Critical patent/JP2023086762A/en
Application granted granted Critical
Publication of JP7260079B1 publication Critical patent/JP7260079B1/en
Publication of JPWO2023048098A5 publication Critical patent/JPWO2023048098A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Claims (14)

銀含有粒子と、
前記銀含有粒子同士がシンタリングすることを促進するシンタリング促進剤と、
を含有する導電性ペーストであって、
前記シンタリング促進剤が式（１）または式（２）で示される化合物を含み、
（メタ）アクリルモノマーをさらに含む、導電性ペースト。
Figure 2023048098000001
 （式（１）中、ｍは１以上２０以下の整数である。）
Figure 2023048098000002
 （式（２）中、ｎは１以上２０以下の整数である。） silver-containing particles;
a sintering accelerator that promotes sintering between the silver-containing particles;
A conductive paste containing
The sintering accelerator contains a compound represented by formula (1) or formula (2),
An electrically conductive paste further comprising a (meth)acrylic monomer .
Figure 2023048098000001
 (In formula (1), m is an integer of 1 or more and 20 or less.)
Figure 2023048098000002
 (In formula (2), n is an integer of 1 or more and 20 or less.) 請求項１に記載の導電性ペーストであって、
前記シンタリング促進剤が式（１）で示される化合物を含み、式（１）中、ｍは１以上１１以下の整数である、導電性ペースト。 The conductive paste according to claim 1,
A conductive paste, wherein the sintering accelerator contains a compound represented by formula (1), wherein m is an integer of 1 or more and 11 or less. 請求項１または２に記載の導電性ペーストであって、
前記シンタリング促進剤が式（２）で示される化合物を含み、式（２）中、ｎは２以上１３以下の整数である、導電性ペースト。 The conductive paste according to claim 1 or 2,
A conductive paste, wherein the sintering accelerator contains a compound represented by formula (2), wherein n is an integer of 2 or more and 13 or less. 請求項１または２に記載の導電性ペーストであって、
前記銀含有粒子が球状粒子、鱗片状粒子、凝集状粒子、および多面体形状の粒子からなる群から選択される１種または２種以上を含む、導電性ペースト。 The conductive paste according to claim 1 or 2 ,
A conductive paste, wherein the silver-containing particles include one or more selected from the group consisting of spherical particles, scale-like particles, aggregated particles, and polyhedral particles. 請求項４に記載の導電性ペーストであって、
前記銀含有粒子が球状粒子、鱗片状粒子、凝集状粒子、および多面体形状の粒子からなる群から選択される２種以上を含む、導電性ペースト。 The conductive paste according to claim 4,
A conductive paste, wherein the silver-containing particles include two or more selected from the group consisting of spherical particles, scale-like particles, aggregated particles, and polyhedral particles. 請求項１または２に記載の導電性ペーストであって、
エポキシモノマーをさらに含む、導電性ペースト。 The conductive paste according to claim 1 or 2 ,
A conductive paste further comprising an epoxy monomer. 請求項６に記載の導電性ペーストであって、
フェノール系硬化剤をさらに含む、導電性ペースト。 The conductive paste according to claim 6,
A conductive paste further comprising a phenolic hardener. 請求項６に記載の導電性ペーストであって、
イミダゾール系硬化促進剤をさらに含む、導電性ペースト。 The conductive paste according to claim 6 ,
An electrically conductive paste, further comprising an imidazole curing accelerator. 請求項１または２に記載の導電性ペーストであって、
ラジカル重合開始剤をさらに含む、導電性ペースト。 The conductive paste according to claim 1 or 2 ,
A conductive paste, further comprising a radical polymerization initiator. 請求項１または２に記載の導電性ペーストであって、
溶剤をさらに含む、導電性ペースト。 The conductive paste according to claim 1 or 2 ,
A conductive paste further comprising a solvent. 請求項１または２に記載の導電性ペーストであって、
当該導電性ペーストを、焼結処理後の厚みが０．０５ｍｍになるようにガラス板上に塗布し、窒素雰囲気下で、３０℃から２００℃まで６０分間かけて昇温し、続けて２００℃で１２０分間焼結処理し、硬化物を得た場合の、当該硬化物の体積抵抗率が４．０μΩ・ｃｍ以上９．５μΩ・ｃｍ以下である、導電性ペースト。 The conductive paste according to claim 1 or 2 ,
The conductive paste was applied to a glass plate so that the thickness after sintering was 0.05 mm, and the temperature was raised from 30°C to 200°C over 60 minutes in a nitrogen atmosphere, and then to 200°C. is sintered for 120 minutes to obtain a cured product having a volume resistivity of 4.0 μΩ·cm or more and 9.5 μΩ·cm or less. 請求項１または２に記載の導電性ペーストを焼結して得られる硬化物。 A cured product obtained by sintering the conductive paste according to claim 1 or 2 . 銀含有粒子同士がシンタリングすることを促進するシンタリング促進剤であって、
式（１）または式（２）で示される化合物を含み、
銀含有粒子と、（メタ）アクリルモノマーと、を含有する導電性ペーストに用いられる、シンタリング促進剤。
Figure 2023048098000003
 （式（１）中、ｍは１以上２０以下の整数である。）
Figure 2023048098000004
 （式（２）中、ｎは１以上２０以下の整数である。） A sintering accelerator that promotes sintering between silver-containing particles,
including a compound represented by formula (1) or formula (2),
A sintering accelerator used in a conductive paste containing silver-containing particles and a (meth)acrylic monomer .
Figure 2023048098000003
 (In formula (1), m is an integer of 1 or more and 20 or less.)
Figure 2023048098000004
 (In formula (2), n is an integer of 1 or more and 20 or less.) 請求項１３に記載のシンタリング促進剤を用いて銀含有粒子のシンタリングを促進する、シンタリング促進方法。 A method for accelerating sintering, which uses the sintering accelerator according to claim 13 to accelerate sintering of silver-containing particles.
JP2023508073A 2021-09-24 2022-09-16 Conductive paste, cured product, sintering accelerator, and sintering acceleration method Active JP7260079B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023060303A JP2023086762A (en) 2021-09-24 2023-04-03 Conductive paste, cured product, sintering accelerator, and method for accelerating sintering

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2021155956 2021-09-24
JP2021155956 2021-09-24
JP2022141719 2022-09-06
JP2022141719 2022-09-06
PCT/JP2022/034825 WO2023048098A1 (en) 2021-09-24 2022-09-16 Conductive paste, cured product, sintering accelerator and method for accelerating sintering

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023060303A Division JP2023086762A (en) 2021-09-24 2023-04-03 Conductive paste, cured product, sintering accelerator, and method for accelerating sintering

Publications (3)

Publication Number Publication Date
JPWO2023048098A1 JPWO2023048098A1 (en) 2023-03-30
JP7260079B1 JP7260079B1 (en) 2023-04-18
JPWO2023048098A5 true JPWO2023048098A5 (en) 2023-08-29

Family

ID=85719462

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023508073A Active JP7260079B1 (en) 2021-09-24 2022-09-16 Conductive paste, cured product, sintering accelerator, and sintering acceleration method
JP2023060303A Pending JP2023086762A (en) 2021-09-24 2023-04-03 Conductive paste, cured product, sintering accelerator, and method for accelerating sintering

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023060303A Pending JP2023086762A (en) 2021-09-24 2023-04-03 Conductive paste, cured product, sintering accelerator, and method for accelerating sintering

Country Status (4)

Country Link
JP (2) JP7260079B1 (en)
KR (1) KR20240058186A (en)
TW (1) TW202330828A (en)
WO (1) WO2023048098A1 (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5045803B2 (en) * 2010-09-29 2012-10-10 横浜ゴム株式会社 Conductive composition and solar battery cell
JP6233792B2 (en) * 2013-01-28 2017-11-22 国立大学法人群馬大学 Conductive paste
JP6333576B2 (en) 2013-03-01 2018-05-30 京セラ株式会社 Thermosetting resin composition, semiconductor device and electric / electronic component

Similar Documents

Publication Publication Date Title
CN103205206B (en) Magnetic material adhesive and preparation method thereof
JP2012114092A5 (en)
CN107635946B (en) Binder for producing inorganic sintered body
WO2016082658A1 (en) Composite binder, positive electrode of lithium rechargeable battery applying composite binder, and method for preparing same
CN102876270B (en) Epoxy resin conducting adhesive with high bonding strength
US20160053039A1 (en) Binder for manufacturing inorganic sintered body
WO2017006854A1 (en) Thermally conductive composition, semiconductor device, process for producing semiconductor device, and method for bonding heat sink plate
JPWO2023048098A5 (en)
CN110655904A (en) Heat-conducting silica gel material, heat-conducting silica gel sheet and preparation method thereof
KR20110095127A (en) Anisotropic conductive film
JP6846767B2 (en) Method for Producing Binder Resin Composition for Water-based Baking, Paste for Water-based Baking, and Binder Resin Composition for Water-based Baking
CN109872856B (en) Mixed rubber magnetic powder and preparation method thereof
JPWO2019171968A1 (en) Acrylic resin and its manufacturing method, and metal fine particle dispersion
CN113524823B (en) Flexible composite material with high electromagnetic shielding performance and preparation method thereof
JP2002037682A (en) Porous silicon carbide sintered body and its manufacturing method
CN108929646B (en) Low-temperature conductive silver adhesive for nano-oxide-doped piezoelectric composite material and preparation method and application thereof
CN114672124B (en) Preparation method of high-dielectric adjustable composite material
CN112694839A (en) Low-odor acrylate structural adhesive and preparation method thereof
JP2001110234A (en) Conductive adhesive
JP2021095562A5 (en)
CN109072014A (en) Adhesive composite, solidfied material, precise part
TWI839358B (en) Conductive paste for vacuum printing
JP2001294445A (en) Glass paste
JP2014086243A (en) Paste for forming an electroconductive film, electroconductive film, method for manufacturing an electroconductive film, and article
JP2019066754A5 (en)