JPWO2023032095A1 - - Google Patents

Info

Publication number
JPWO2023032095A1
JPWO2023032095A1 JP2023544886A JP2023544886A JPWO2023032095A1 JP WO2023032095 A1 JPWO2023032095 A1 JP WO2023032095A1 JP 2023544886 A JP2023544886 A JP 2023544886A JP 2023544886 A JP2023544886 A JP 2023544886A JP WO2023032095 A1 JPWO2023032095 A1 JP WO2023032095A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023544886A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023032095A1 publication Critical patent/JPWO2023032095A1/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0608—Height gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/022—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by means of tv-camera scanning
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G01B11/2518—Projection by scanning of the object
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/50—Depth or shape recovery
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/54—Revolving an optical measuring instrument around a body

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
JP2023544886A 2021-09-01 2021-09-01 Pending JPWO2023032095A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/032173 WO2023032095A1 (en) 2021-09-01 2021-09-01 Workpiece height measurement device, and mounting substrate inspection device using same

Publications (1)

Publication Number Publication Date
JPWO2023032095A1 true JPWO2023032095A1 (en) 2023-03-09

Family

ID=85410941

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023544886A Pending JPWO2023032095A1 (en) 2021-09-01 2021-09-01

Country Status (6)

Country Link
JP (1) JPWO2023032095A1 (en)
KR (1) KR20240042042A (en)
CN (1) CN117881941A (en)
DE (1) DE112021007975T5 (en)
TW (1) TWI818349B (en)
WO (1) WO2023032095A1 (en)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3018887B2 (en) * 1994-02-01 2000-03-13 トヨタ自動車株式会社 3D shape measuring device
JP5564348B2 (en) * 2010-07-15 2014-07-30 株式会社キーエンス Image processing apparatus and appearance inspection method
JP2012122844A (en) * 2010-12-08 2012-06-28 Aisin Seiki Co Ltd Surface inspection device
JP2015072197A (en) 2013-10-03 2015-04-16 株式会社ニコン Shape measurement device, structure manufacturing system, shape measurement method, structure manufacturing method, and shape measurement program
JP6184289B2 (en) * 2013-10-17 2017-08-23 株式会社キーエンス 3D image processing apparatus, 3D image processing method, 3D image processing program, computer-readable recording medium, and recorded apparatus
TWI758383B (en) * 2017-07-19 2022-03-21 日商日本電產理德股份有限公司 Photographing device, bump inspection device, and photographing method
DE112018008035T5 (en) * 2018-09-27 2021-06-24 Yamaha Hatsudoki Kabushiki Kaisha Three-dimensional measuring device
JP7178426B2 (en) * 2018-12-28 2022-11-25 ヤマハ発動機株式会社 Three-dimensional measuring device and workpiece working device

Also Published As

Publication number Publication date
CN117881941A (en) 2024-04-12
TWI818349B (en) 2023-10-11
KR20240042042A (en) 2024-04-01
WO2023032095A1 (en) 2023-03-09
TW202311702A (en) 2023-03-16
DE112021007975T5 (en) 2024-05-08

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20231019