JPWO2023026892A1 - - Google Patents

Info

Publication number
JPWO2023026892A1
JPWO2023026892A1 JP2023543821A JP2023543821A JPWO2023026892A1 JP WO2023026892 A1 JPWO2023026892 A1 JP WO2023026892A1 JP 2023543821 A JP2023543821 A JP 2023543821A JP 2023543821 A JP2023543821 A JP 2023543821A JP WO2023026892 A1 JPWO2023026892 A1 JP WO2023026892A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023543821A
Other languages
Japanese (ja)
Other versions
JPWO2023026892A5 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023026892A1 publication Critical patent/JPWO2023026892A1/ja
Publication of JPWO2023026892A5 publication Critical patent/JPWO2023026892A5/ja
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Laminated Bodies (AREA)
JP2023543821A 2021-08-27 2022-08-15 Pending JPWO2023026892A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021138592 2021-08-27
PCT/JP2022/030902 WO2023026892A1 (en) 2021-08-27 2022-08-15 Resin composition, cured article, layered body, cured article production method, layered body production method, semiconductor device production method, semiconductor device, and base generating agent

Publications (2)

Publication Number Publication Date
JPWO2023026892A1 true JPWO2023026892A1 (en) 2023-03-02
JPWO2023026892A5 JPWO2023026892A5 (en) 2024-05-22

Family

ID=85321934

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023543821A Pending JPWO2023026892A1 (en) 2021-08-27 2022-08-15

Country Status (4)

Country Link
JP (1) JPWO2023026892A1 (en)
CN (1) CN117836715A (en)
TW (1) TW202313572A (en)
WO (1) WO2023026892A1 (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020066315A1 (en) * 2018-09-27 2020-04-02 富士フイルム株式会社 Photosensitive resin composition, cured product, layered product, production method for cured product, and semiconductor device
EP3859447A4 (en) * 2018-09-28 2021-11-17 FUJIFILM Corporation Photosensitive resin composition, cured film, laminate, method for producing cured film, and semiconductor device

Also Published As

Publication number Publication date
TW202313572A (en) 2023-04-01
WO2023026892A1 (en) 2023-03-02
CN117836715A (en) 2024-04-05

Similar Documents

Publication Publication Date Title
BR112023005462A2 (en)
BR112023012656A2 (en)
BR112021014123A2 (en)
BR112022024743A2 (en)
BR102021018859A2 (en)
JPWO2022059622A1 (en)
BR102021015500A2 (en)
JPWO2022030107A1 (en)
BR112022009896A2 (en)
JPWO2023026892A1 (en)
BR112023011738A2 (en)
BR112023016292A2 (en)
BR112023004146A2 (en)
BR112023011610A2 (en)
BR112023011539A2 (en)
BR112023008976A2 (en)
BR112023009656A2 (en)
BR112023006729A2 (en)
BR102021020147A2 (en)
BR102021018926A2 (en)
BR102021018167A2 (en)
JPWO2022059621A1 (en)
BR102021017576A2 (en)
BR102021016837A2 (en)
BR102021016551A2 (en)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240126