JPWO2023026564A1 - - Google Patents
Info
- Publication number
- JPWO2023026564A1 JPWO2023026564A1 JP2023543672A JP2023543672A JPWO2023026564A1 JP WO2023026564 A1 JPWO2023026564 A1 JP WO2023026564A1 JP 2023543672 A JP2023543672 A JP 2023543672A JP 2023543672 A JP2023543672 A JP 2023543672A JP WO2023026564 A1 JPWO2023026564 A1 JP WO2023026564A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
Landscapes
- Engineering & Computer Science (AREA)
- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021138481 | 2021-08-27 | ||
| PCT/JP2022/014866 WO2023026564A1 (en) | 2021-08-27 | 2022-03-28 | Component mounting device and evaluation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023026564A1 true JPWO2023026564A1 (en) | 2023-03-02 |
Family
ID=85322627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023543672A Pending JPWO2023026564A1 (en) | 2021-08-27 | 2022-03-28 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2023026564A1 (en) |
| WO (1) | WO2023026564A1 (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0722783A (en) * | 1993-06-30 | 1995-01-24 | Matsushita Electric Ind Co Ltd | Method and apparatus for mounting of electronic component |
| JP4023851B2 (en) * | 1996-06-27 | 2007-12-19 | 松下電器産業株式会社 | Electronic component mounting method |
| JP4015502B2 (en) * | 2002-08-08 | 2007-11-28 | 松下電器産業株式会社 | Component holding member pass / fail detection apparatus and method, and electronic component mounting apparatus and method |
-
2022
- 2022-03-28 WO PCT/JP2022/014866 patent/WO2023026564A1/en active Application Filing
- 2022-03-28 JP JP2023543672A patent/JPWO2023026564A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023026564A1 (en) | 2023-03-02 |