JPWO2023008252A1 - - Google Patents
Info
- Publication number
- JPWO2023008252A1 JPWO2023008252A1 JP2023538453A JP2023538453A JPWO2023008252A1 JP WO2023008252 A1 JPWO2023008252 A1 JP WO2023008252A1 JP 2023538453 A JP2023538453 A JP 2023538453A JP 2023538453 A JP2023538453 A JP 2023538453A JP WO2023008252 A1 JPWO2023008252 A1 JP WO2023008252A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021121281 | 2021-07-26 | ||
| PCT/JP2022/028038 WO2023008252A1 (en) | 2021-07-26 | 2022-07-19 | Package and power module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023008252A1 true JPWO2023008252A1 (en) | 2023-02-02 |
| JPWO2023008252A5 JPWO2023008252A5 (en) | 2024-03-25 |
Family
ID=85087939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023538453A Pending JPWO2023008252A1 (en) | 2021-07-26 | 2022-07-19 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2023008252A1 (en) |
| WO (1) | WO2023008252A1 (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11111909A (en) * | 1997-10-07 | 1999-04-23 | Seiichi Serizawa | Lead frame for semiconductor device |
| JP4652281B2 (en) * | 2006-05-29 | 2011-03-16 | パナソニック株式会社 | Resin-sealed semiconductor device |
| JP2020155699A (en) * | 2019-03-22 | 2020-09-24 | 日本碍子株式会社 | Manufacturing method for package and power semiconductor module |
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2022
- 2022-07-19 WO PCT/JP2022/028038 patent/WO2023008252A1/en active Application Filing
- 2022-07-19 JP JP2023538453A patent/JPWO2023008252A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023008252A1 (en) | 2023-02-02 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20231222 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20231222 |