JPWO2023002789A1 - - Google Patents

Info

Publication number
JPWO2023002789A1
JPWO2023002789A1 JP2022559970A JP2022559970A JPWO2023002789A1 JP WO2023002789 A1 JPWO2023002789 A1 JP WO2023002789A1 JP 2022559970 A JP2022559970 A JP 2022559970A JP 2022559970 A JP2022559970 A JP 2022559970A JP WO2023002789 A1 JPWO2023002789 A1 JP WO2023002789A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022559970A
Other languages
Japanese (ja)
Other versions
JPWO2023002789A5 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023002789A1 publication Critical patent/JPWO2023002789A1/ja
Publication of JPWO2023002789A5 publication Critical patent/JPWO2023002789A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
JP2022559970A 2021-07-21 2022-06-20 Pending JPWO2023002789A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021120268 2021-07-21
PCT/JP2022/024531 WO2023002789A1 (en) 2021-07-21 2022-06-20 Thermosetting resin composition, substrate for power modules, printed wiring board and heat dissipation sheet

Publications (2)

Publication Number Publication Date
JPWO2023002789A1 true JPWO2023002789A1 (en) 2023-01-26
JPWO2023002789A5 JPWO2023002789A5 (en) 2023-06-28

Family

ID=84979962

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022559970A Pending JPWO2023002789A1 (en) 2021-07-21 2022-06-20

Country Status (2)

Country Link
JP (1) JPWO2023002789A1 (en)
WO (1) WO2023002789A1 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017014237A1 (en) * 2015-07-23 2017-01-26 住友ベークライト株式会社 Substrate for power modules, circuit board for power modules, and power module
JP2020180216A (en) * 2019-04-25 2020-11-05 住友ベークライト株式会社 Resin composition and electronic component structure

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017014237A1 (en) * 2015-07-23 2017-01-26 住友ベークライト株式会社 Substrate for power modules, circuit board for power modules, and power module
JP2020180216A (en) * 2019-04-25 2020-11-05 住友ベークライト株式会社 Resin composition and electronic component structure

Also Published As

Publication number Publication date
WO2023002789A1 (en) 2023-01-26

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