JPWO2022270541A1 - - Google Patents
Info
- Publication number
- JPWO2022270541A1 JPWO2022270541A1 JP2023530092A JP2023530092A JPWO2022270541A1 JP WO2022270541 A1 JPWO2022270541 A1 JP WO2022270541A1 JP 2023530092 A JP2023530092 A JP 2023530092A JP 2023530092 A JP2023530092 A JP 2023530092A JP WO2022270541 A1 JPWO2022270541 A1 JP WO2022270541A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
- C08F290/14—Polymers provided for in subclass C08G
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/16—Polyester-imides
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Polymerisation Methods In General (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021105682 | 2021-06-25 | ||
| PCT/JP2022/024894 WO2022270541A1 (en) | 2021-06-25 | 2022-06-22 | Negative photosensitive resin composition, negative photosensitive polymer, cured film, and semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022270541A1 true JPWO2022270541A1 (en) | 2022-12-29 |
Family
ID=84545757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023530092A Pending JPWO2022270541A1 (en) | 2021-06-25 | 2022-06-22 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2022270541A1 (en) |
| TW (1) | TW202311306A (en) |
| WO (1) | WO2022270541A1 (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0321398B1 (en) * | 1987-12-15 | 1994-08-17 | Ciba-Geigy Ag | Autophotocrosslinkable copolyimides and compositions of polyimides |
| JP2557331B2 (en) * | 1992-06-24 | 1996-11-27 | 東芝ケミカル株式会社 | Photosensitive polyimide composition |
| JP2020531651A (en) * | 2018-07-20 | 2020-11-05 | エルジー・ケム・リミテッド | Polyimide resin and negative photosensitive resin composition containing the same |
| TW202112907A (en) * | 2019-08-26 | 2021-04-01 | 日商富士軟片股份有限公司 | Curable resin composition, cured film, layered product, method for producing cured film, semiconductor device, resin, and method for producing resin |
| JP2021152634A (en) * | 2020-03-19 | 2021-09-30 | 住友ベークライト株式会社 | Negative photosensitive resin composition, negative photosensitive polymer and applications thereof |
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2022
- 2022-06-22 WO PCT/JP2022/024894 patent/WO2022270541A1/en active Application Filing
- 2022-06-22 JP JP2023530092A patent/JPWO2022270541A1/ja active Pending
- 2022-06-24 TW TW111123674A patent/TW202311306A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202311306A (en) | 2023-03-16 |
| WO2022270541A1 (en) | 2022-12-29 |