JPWO2022270305A1 - - Google Patents

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Publication number
JPWO2022270305A1
JPWO2022270305A1 JP2023529810A JP2023529810A JPWO2022270305A1 JP WO2022270305 A1 JPWO2022270305 A1 JP WO2022270305A1 JP 2023529810 A JP2023529810 A JP 2023529810A JP 2023529810 A JP2023529810 A JP 2023529810A JP WO2022270305 A1 JPWO2022270305 A1 JP WO2022270305A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023529810A
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Japanese (ja)
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Filing date
Publication date
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Publication of JPWO2022270305A1 publication Critical patent/JPWO2022270305A1/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
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    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/49531—Additional leads the additional leads being a wiring board
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    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/182—Disposition

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2023529810A 2021-06-22 2022-06-08 Pending JPWO2022270305A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021103355 2021-06-22
PCT/JP2022/023069 WO2022270305A1 (en) 2021-06-22 2022-06-08 Semiconductor device and method for manufacturing semiconductor device

Publications (1)

Publication Number Publication Date
JPWO2022270305A1 true JPWO2022270305A1 (en) 2022-12-29

Family

ID=84544284

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023529810A Pending JPWO2022270305A1 (en) 2021-06-22 2022-06-08

Country Status (5)

Country Link
US (1) US20240112992A1 (en)
JP (1) JPWO2022270305A1 (en)
CN (1) CN117616566A (en)
DE (1) DE112022003156T5 (en)
WO (1) WO2022270305A1 (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5734736B2 (en) * 2011-05-18 2015-06-17 新電元工業株式会社 Power module manufacturing method
US11227822B2 (en) 2018-04-19 2022-01-18 Rohm Co., Ltd. Semiconductor device

Also Published As

Publication number Publication date
US20240112992A1 (en) 2024-04-04
CN117616566A (en) 2024-02-27
WO2022270305A1 (en) 2022-12-29
DE112022003156T5 (en) 2024-03-28

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