JPWO2022255231A1 - - Google Patents
Info
- Publication number
- JPWO2022255231A1 JPWO2022255231A1 JP2023525777A JP2023525777A JPWO2022255231A1 JP WO2022255231 A1 JPWO2022255231 A1 JP WO2022255231A1 JP 2023525777 A JP2023525777 A JP 2023525777A JP 2023525777 A JP2023525777 A JP 2023525777A JP WO2022255231 A1 JPWO2022255231 A1 JP WO2022255231A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021094372 | 2021-06-04 | ||
PCT/JP2022/021654 WO2022255231A1 (en) | 2021-06-04 | 2022-05-26 | Modified epoxy resin, resin composition, cured product, laminate for electric/electronic circuits, and modified epoxy resin production method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022255231A1 true JPWO2022255231A1 (en) | 2022-12-08 |
Family
ID=84324381
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023525777A Pending JPWO2022255231A1 (en) | 2021-06-04 | 2022-05-26 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2022255231A1 (en) |
TW (1) | TW202248268A (en) |
WO (1) | WO2022255231A1 (en) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6672699B2 (en) * | 2014-10-29 | 2020-03-25 | 三菱ケミカル株式会社 | Epoxy resin, epoxy resin composition, cured product, laminate for electric / electronic circuit, and method for producing epoxy resin |
JP6686666B2 (en) * | 2016-04-21 | 2020-04-22 | 三菱ケミカル株式会社 | Epoxy resin, epoxy resin composition, cured product, laminate for electric / electronic circuit, and method for producing epoxy resin |
JP7069613B2 (en) * | 2017-09-19 | 2022-05-18 | 三菱ケミカル株式会社 | Epoxy resin, epoxy resin composition, cured product, and laminated board for electric / electronic circuits |
TW202142585A (en) * | 2020-03-19 | 2021-11-16 | 日商日鐵化學材料股份有限公司 | Phenoxy resin, resin composition, cured product, laminate for electric/electronic circuits, and method for producing phenoxy resin |
-
2022
- 2022-05-26 JP JP2023525777A patent/JPWO2022255231A1/ja active Pending
- 2022-05-26 WO PCT/JP2022/021654 patent/WO2022255231A1/en active Application Filing
- 2022-05-30 TW TW111120093A patent/TW202248268A/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2022255231A1 (en) | 2022-12-08 |
TW202248268A (en) | 2022-12-16 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20231020 |