JPWO2022210703A1 - - Google Patents

Info

Publication number
JPWO2022210703A1
JPWO2022210703A1 JP2023511373A JP2023511373A JPWO2022210703A1 JP WO2022210703 A1 JPWO2022210703 A1 JP WO2022210703A1 JP 2023511373 A JP2023511373 A JP 2023511373A JP 2023511373 A JP2023511373 A JP 2023511373A JP WO2022210703 A1 JPWO2022210703 A1 JP WO2022210703A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023511373A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022210703A1 publication Critical patent/JPWO2022210703A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F285/00—Macromolecular compounds obtained by polymerising monomers on to preformed graft polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J121/00—Adhesives based on unspecified rubbers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2023511373A 2021-03-31 2022-03-29 Pending JPWO2022210703A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021059636 2021-03-31
PCT/JP2022/015420 WO2022210703A1 (en) 2021-03-31 2022-03-29 Adhesive composition and article

Publications (1)

Publication Number Publication Date
JPWO2022210703A1 true JPWO2022210703A1 (en) 2022-10-06

Family

ID=83456286

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023511373A Pending JPWO2022210703A1 (en) 2021-03-31 2022-03-29

Country Status (4)

Country Link
JP (1) JPWO2022210703A1 (en)
CN (1) CN117062885A (en)
TW (1) TW202302789A (en)
WO (1) WO2022210703A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024154634A1 (en) * 2023-01-20 2024-07-25 デンカ株式会社 Composition, component, and motor
WO2024154633A1 (en) * 2023-01-20 2024-07-25 デンカ株式会社 Composition, component, and motor
WO2024154640A1 (en) * 2023-01-20 2024-07-25 デンカ株式会社 Composition, component, and motor

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1754762A4 (en) * 2004-06-09 2009-07-22 Hitachi Chemical Co Ltd Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
JP2012102224A (en) * 2010-11-09 2012-05-31 Bridgestone Corp Adhesive resin composition
JP5733175B2 (en) * 2011-11-28 2015-06-10 東亞合成株式会社 Active energy ray-curable adhesive composition
JP2016155892A (en) * 2015-02-23 2016-09-01 スリーエム イノベイティブ プロパティズ カンパニー Two-part adhesive
JP6739519B2 (en) * 2016-03-31 2020-08-12 デンカ株式会社 Composition
CN108359388B (en) * 2017-01-26 2021-09-14 电化株式会社 Curable composition
FR3084370B1 (en) * 2018-07-24 2021-03-05 Jacret COMPOSITION FOR STRUCTURAL ADHESIVE
JP7133395B2 (en) * 2018-08-27 2022-09-08 デンカ株式会社 Curable composition
US12054572B2 (en) * 2018-11-15 2024-08-06 Denka Company Limited Composition

Also Published As

Publication number Publication date
WO2022210703A1 (en) 2022-10-06
TW202302789A (en) 2023-01-16
CN117062885A (en) 2023-11-14

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