JPWO2022210055A1 - - Google Patents
Info
- Publication number
- JPWO2022210055A1 JPWO2022210055A1 JP2023510994A JP2023510994A JPWO2022210055A1 JP WO2022210055 A1 JPWO2022210055 A1 JP WO2022210055A1 JP 2023510994 A JP2023510994 A JP 2023510994A JP 2023510994 A JP2023510994 A JP 2023510994A JP WO2022210055 A1 JPWO2022210055 A1 JP WO2022210055A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021057809 | 2021-03-30 | ||
| PCT/JP2022/012878 WO2022210055A1 (en) | 2021-03-30 | 2022-03-18 | Adhesive sheet, bonded body, and method for separating bonded body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022210055A1 true JPWO2022210055A1 (en) | 2022-10-06 |
Family
ID=83456036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023510994A Pending JPWO2022210055A1 (en) | 2021-03-30 | 2022-03-18 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2022210055A1 (en) |
| WO (1) | WO2022210055A1 (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040112514A1 (en) * | 2002-12-16 | 2004-06-17 | Xyron, Inc. | Device and method for performing a master processing operation |
| US8708305B2 (en) * | 2010-08-04 | 2014-04-29 | 3M Innovative Properties Company | Adhesively mounted article support assembly with exposed pull tab |
| US20150218425A1 (en) * | 2014-02-05 | 2015-08-06 | Apple Inc. | Stretch release conductive adhesive |
| JP6318398B2 (en) * | 2014-02-27 | 2018-05-09 | 日東電工株式会社 | Laminate |
| JP6633339B2 (en) * | 2015-10-14 | 2020-01-22 | 日東電工株式会社 | Adhesive products with tabs |
| JP3220121U (en) * | 2018-12-03 | 2019-02-14 | 後藤 秀樹 | Binding tape |
| US20220282125A1 (en) * | 2019-08-09 | 2022-09-08 | Nitto Denko Corporation | Electrical debonding type adhesive sheet, joined body, and method for separating joined body |
-
2022
- 2022-03-18 JP JP2023510994A patent/JPWO2022210055A1/ja active Pending
- 2022-03-18 WO PCT/JP2022/012878 patent/WO2022210055A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022210055A1 (en) | 2022-10-06 |