JPWO2022209758A1 - - Google Patents
Info
- Publication number
- JPWO2022209758A1 JPWO2022209758A1 JP2023510833A JP2023510833A JPWO2022209758A1 JP WO2022209758 A1 JPWO2022209758 A1 JP WO2022209758A1 JP 2023510833 A JP2023510833 A JP 2023510833A JP 2023510833 A JP2023510833 A JP 2023510833A JP WO2022209758 A1 JPWO2022209758 A1 JP WO2022209758A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021057915 | 2021-03-30 | ||
| PCT/JP2022/010879 WO2022209758A1 (ja) | 2021-03-30 | 2022-03-11 | 研磨方法、研磨用組成物セット |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022209758A1 true JPWO2022209758A1 (ko) | 2022-10-06 |
Family
ID=83456088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023510833A Pending JPWO2022209758A1 (ko) | 2021-03-30 | 2022-03-11 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2022209758A1 (ko) |
| TW (1) | TW202305084A (ko) |
| WO (1) | WO2022209758A1 (ko) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5312887B2 (ja) * | 2008-09-24 | 2013-10-09 | 富士フイルム株式会社 | 研磨液 |
| DE112014003673T5 (de) * | 2013-08-09 | 2016-05-12 | Fujimi Incorporated | Verfahren zum Herstellen eines polierten Objekts und Poliermittelsatz |
| CN110914958B (zh) * | 2017-07-21 | 2023-08-11 | 福吉米株式会社 | 基板的研磨方法及研磨用组合物套组 |
| JPWO2019043890A1 (ja) * | 2017-08-31 | 2020-08-06 | 株式会社Sumco | 半導体ウェーハの製造方法 |
| SG11201908968QA (en) * | 2017-10-17 | 2019-10-30 | Sumco Corp | Method of polishing silicon wafer |
| JP7330822B2 (ja) * | 2019-03-22 | 2023-08-22 | 株式会社フジミインコーポレーテッド | 研磨用組成物および研磨方法 |
-
2022
- 2022-03-11 WO PCT/JP2022/010879 patent/WO2022209758A1/ja active Application Filing
- 2022-03-11 JP JP2023510833A patent/JPWO2022209758A1/ja active Pending
- 2022-03-29 TW TW111111836A patent/TW202305084A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022209758A1 (ja) | 2022-10-06 |
| TW202305084A (zh) | 2023-02-01 |