JPWO2022209064A1 - - Google Patents
Info
- Publication number
- JPWO2022209064A1 JPWO2022209064A1 JP2022520675A JP2022520675A JPWO2022209064A1 JP WO2022209064 A1 JPWO2022209064 A1 JP WO2022209064A1 JP 2022520675 A JP2022520675 A JP 2022520675A JP 2022520675 A JP2022520675 A JP 2022520675A JP WO2022209064 A1 JPWO2022209064 A1 JP WO2022209064A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Silicon Polymers (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023086048A JP2023105012A (en) | 2021-03-30 | 2023-05-25 | Adhesive paste, method for using adhesive paste and method for manufacturing semiconductor device |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021056736 | 2021-03-30 | ||
| PCT/JP2021/047322 WO2022209064A1 (en) | 2021-03-30 | 2021-12-21 | Adhesive paste, method for using adhesive paste, and method for producing semiconductor device |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023086048A Division JP2023105012A (en) | 2021-03-30 | 2023-05-25 | Adhesive paste, method for using adhesive paste and method for manufacturing semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022209064A1 true JPWO2022209064A1 (en) | 2022-10-06 |
| JPWO2022209064A5 JPWO2022209064A5 (en) | 2023-02-28 |
Family
ID=83455825
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022520675A Pending JPWO2022209064A1 (en) | 2021-03-30 | 2021-12-21 | |
| JP2023086048A Pending JP2023105012A (en) | 2021-03-30 | 2023-05-25 | Adhesive paste, method for using adhesive paste and method for manufacturing semiconductor device |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023086048A Pending JP2023105012A (en) | 2021-03-30 | 2023-05-25 | Adhesive paste, method for using adhesive paste and method for manufacturing semiconductor device |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JPWO2022209064A1 (en) |
| CN (1) | CN116981751A (en) |
| TW (1) | TW202237790A (en) |
| WO (1) | WO2022209064A1 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011155482A1 (en) * | 2010-06-08 | 2011-12-15 | 積水化学工業株式会社 | Die-bonding material for optical semiconductor devices and optical semiconductor device using same |
| WO2016031731A1 (en) * | 2014-08-26 | 2016-03-03 | リンテック株式会社 | Curable composition, cured product, method for using curable composition, and optical device |
| JP2018100401A (en) * | 2016-12-20 | 2018-06-28 | コミッサリア ア レネルジー アトミーク エ オ ゼネルジ ザルタナテイヴ | Adhesive composition and use thereof in electronics |
| JP2020176212A (en) * | 2019-04-18 | 2020-10-29 | リンテック株式会社 | Die bonding material, light-emitting device and method for manufacturing light-emitting device |
-
2021
- 2021-12-21 CN CN202180095979.3A patent/CN116981751A/en active Pending
- 2021-12-21 WO PCT/JP2021/047322 patent/WO2022209064A1/en active Application Filing
- 2021-12-21 JP JP2022520675A patent/JPWO2022209064A1/ja active Pending
- 2021-12-24 TW TW110148604A patent/TW202237790A/en unknown
-
2023
- 2023-05-25 JP JP2023086048A patent/JP2023105012A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011155482A1 (en) * | 2010-06-08 | 2011-12-15 | 積水化学工業株式会社 | Die-bonding material for optical semiconductor devices and optical semiconductor device using same |
| WO2016031731A1 (en) * | 2014-08-26 | 2016-03-03 | リンテック株式会社 | Curable composition, cured product, method for using curable composition, and optical device |
| JP2018100401A (en) * | 2016-12-20 | 2018-06-28 | コミッサリア ア レネルジー アトミーク エ オ ゼネルジ ザルタナテイヴ | Adhesive composition and use thereof in electronics |
| JP2020176212A (en) * | 2019-04-18 | 2020-10-29 | リンテック株式会社 | Die bonding material, light-emitting device and method for manufacturing light-emitting device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2023105012A (en) | 2023-07-28 |
| TW202237790A (en) | 2022-10-01 |
| CN116981751A (en) | 2023-10-31 |
| WO2022209064A1 (en) | 2022-10-06 |
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