JPWO2022208814A1 - - Google Patents
Info
- Publication number
- JPWO2022208814A1 JPWO2022208814A1 JP2021558780A JP2021558780A JPWO2022208814A1 JP WO2022208814 A1 JPWO2022208814 A1 JP WO2022208814A1 JP 2021558780 A JP2021558780 A JP 2021558780A JP 2021558780 A JP2021558780 A JP 2021558780A JP WO2022208814 A1 JPWO2022208814 A1 JP WO2022208814A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J107/00—Adhesives based on natural rubber
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2021/014048 WO2022208814A1 (en) | 2021-03-31 | 2021-03-31 | Pressure-sensitive adhesive composition and pressure-sensitive adhesive tape |
Publications (2)
Publication Number | Publication Date |
---|---|
JP7072735B1 JP7072735B1 (en) | 2022-05-20 |
JPWO2022208814A1 true JPWO2022208814A1 (en) | 2022-10-06 |
Family
ID=81654299
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021558780A Active JP7072735B1 (en) | 2021-03-31 | 2021-03-31 | Adhesive composition and adhesive tape |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7072735B1 (en) |
KR (1) | KR102624251B1 (en) |
CN (1) | CN116348565B (en) |
TW (1) | TWI814280B (en) |
WO (1) | WO2022208814A1 (en) |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW383332B (en) * | 1995-02-14 | 2000-03-01 | Toyo Chemicals Co Ltd | Pressure-sensitive adhesive for attaching semiconductor wafer onto sheet |
JP3992162B2 (en) * | 1996-10-14 | 2007-10-17 | 日東電工株式会社 | Packaging material |
JP2000086986A (en) * | 1998-09-11 | 2000-03-28 | Oji Kako Kk | Adhesive tape |
DE19939078A1 (en) * | 1999-08-18 | 2001-02-22 | Beiersdorf Ag | Use of isocyanates in the production of highly viscous self-adhesive compositions |
JP4651767B2 (en) | 1999-12-27 | 2011-03-16 | 日東電工株式会社 | Solid-type adhesive composition and its adhesive sheet |
WO2012132520A1 (en) * | 2011-03-31 | 2012-10-04 | リンテック株式会社 | Pressure sensitive adhesive sheet |
JP2013253136A (en) * | 2012-06-05 | 2013-12-19 | Nitto Denko Corp | Adhesive layer and adhesive sheet |
JP6075978B2 (en) * | 2012-06-25 | 2017-02-08 | 日東電工株式会社 | Adhesive film |
JP6022848B2 (en) | 2012-08-07 | 2016-11-09 | 日立マクセル株式会社 | Adhesive tape, temporary adhesive tape and adhesive composition |
JP6177643B2 (en) * | 2012-10-18 | 2017-08-09 | 積水化学工業株式会社 | Adhesive tape for fixing articles |
JP6450307B2 (en) | 2013-05-16 | 2019-01-09 | 積水化学工業株式会社 | Adhesive tape for fixing articles |
CN105745293A (en) * | 2013-11-26 | 2016-07-06 | 琳得科株式会社 | Double-sided adhesive sheet and method for producing double-sided adhesive sheet |
WO2016056467A1 (en) * | 2014-10-06 | 2016-04-14 | 日東電工株式会社 | Masking sheet for anodizing |
FR3037966B1 (en) * | 2015-06-24 | 2019-08-16 | Novacel | PRESSURE-SENSITIVE ADHESIVE FILM AND ITS USE FOR SURFACE PROTECTION |
JP6873682B2 (en) * | 2015-12-25 | 2021-05-19 | 日東電工株式会社 | A method for manufacturing a rubber-based pressure-sensitive adhesive composition, a rubber-based pressure-sensitive adhesive layer, an optical film with a rubber-based pressure-sensitive adhesive layer, an optical member, an image display device, and a rubber-based pressure-sensitive adhesive layer. |
JP6703875B2 (en) * | 2016-03-30 | 2020-06-03 | マクセルホールディングス株式会社 | Adhesive tape |
WO2019131603A1 (en) * | 2017-12-27 | 2019-07-04 | 古河電気工業株式会社 | Radiation curable adhesive tape for dicing |
-
2021
- 2021-03-31 CN CN202180072629.5A patent/CN116348565B/en active Active
- 2021-03-31 WO PCT/JP2021/014048 patent/WO2022208814A1/en active Application Filing
- 2021-03-31 JP JP2021558780A patent/JP7072735B1/en active Active
- 2021-03-31 KR KR1020237012161A patent/KR102624251B1/en active IP Right Grant
-
2022
- 2022-03-15 TW TW111109313A patent/TWI814280B/en active
Also Published As
Publication number | Publication date |
---|---|
TWI814280B (en) | 2023-09-01 |
WO2022208814A1 (en) | 2022-10-06 |
KR102624251B1 (en) | 2024-01-11 |
TW202305078A (en) | 2023-02-01 |
CN116348565A (en) | 2023-06-27 |
JP7072735B1 (en) | 2022-05-20 |
KR20230054488A (en) | 2023-04-24 |
CN116348565B (en) | 2024-03-12 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20210930 |
|
A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20210930 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20220104 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220302 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20220426 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20220510 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7072735 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |