JPWO2022202795A1 - - Google Patents
Info
- Publication number
- JPWO2022202795A1 JPWO2022202795A1 JP2023509188A JP2023509188A JPWO2022202795A1 JP WO2022202795 A1 JPWO2022202795 A1 JP WO2022202795A1 JP 2023509188 A JP2023509188 A JP 2023509188A JP 2023509188 A JP2023509188 A JP 2023509188A JP WO2022202795 A1 JPWO2022202795 A1 JP WO2022202795A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021053449 | 2021-03-26 | ||
| PCT/JP2022/013103 WO2022202795A1 (en) | 2021-03-26 | 2022-03-22 | Metal plate, laminate, and insulated circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022202795A1 true JPWO2022202795A1 (en) | 2022-09-29 |
Family
ID=83395851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023509188A Pending JPWO2022202795A1 (en) | 2021-03-26 | 2022-03-22 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2022202795A1 (en) |
| TW (1) | TW202301916A (en) |
| WO (1) | WO2022202795A1 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3291486B2 (en) * | 1999-09-06 | 2002-06-10 | 三井金属鉱業株式会社 | Surface-regulated electrolytic copper foil, its production method and its use |
| JP7234743B2 (en) * | 2019-03-29 | 2023-03-08 | 三菱マテリアル株式会社 | Joined body and insulating circuit board |
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2022
- 2022-03-22 WO PCT/JP2022/013103 patent/WO2022202795A1/en active Application Filing
- 2022-03-22 JP JP2023509188A patent/JPWO2022202795A1/ja active Pending
- 2022-03-24 TW TW111111113A patent/TW202301916A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022202795A1 (en) | 2022-09-29 |
| TW202301916A (en) | 2023-01-01 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230810 |