JPWO2022201857A1 - - Google Patents
Info
- Publication number
- JPWO2022201857A1 JPWO2022201857A1 JP2023508726A JP2023508726A JPWO2022201857A1 JP WO2022201857 A1 JPWO2022201857 A1 JP WO2022201857A1 JP 2023508726 A JP2023508726 A JP 2023508726A JP 2023508726 A JP2023508726 A JP 2023508726A JP WO2022201857 A1 JPWO2022201857 A1 JP WO2022201857A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021052064 | 2021-03-25 | ||
| JP2021151207 | 2021-09-16 | ||
| PCT/JP2022/003425 WO2022201857A1 (en) | 2021-03-25 | 2022-01-28 | Surface protective sheet and treatment method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022201857A1 true JPWO2022201857A1 (en) | 2022-09-29 |
Family
ID=83396767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023508726A Pending JPWO2022201857A1 (en) | 2021-03-25 | 2022-01-28 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2022201857A1 (en) |
| TW (1) | TW202300608A (en) |
| WO (1) | WO2022201857A1 (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MX169921B (en) * | 1988-10-26 | 1993-07-30 | Kimberly Clark Co | IMPROVEMENTS TO LEAF MATERIAL WITH PRESSURE SENSITIVE ADHESIVE AND REMOVABLE WITH WATER |
| US5284690A (en) * | 1992-11-03 | 1994-02-08 | Rohm And Haas Company | Aqueous release coating composition for pressure sensitive adhesives |
| JP2006241264A (en) * | 2005-03-02 | 2006-09-14 | Kuramoto Sangyo:Kk | Adhesive composition and hot water peelable label |
| WO2010077541A1 (en) * | 2008-12-31 | 2010-07-08 | 3M Innovative Properties Company | Stretch releasable adhesive tape |
| KR102500919B1 (en) * | 2018-02-05 | 2023-02-16 | 닛토덴코 가부시키가이샤 | Adhesive sheet and peeling method for adhesive sheet |
| JP2021024182A (en) * | 2019-08-02 | 2021-02-22 | 日東電工株式会社 | Laminate and peeling method |
| JP7441012B2 (en) * | 2019-08-02 | 2024-02-29 | 日東電工株式会社 | adhesive sheet |
-
2022
- 2022-01-28 WO PCT/JP2022/003425 patent/WO2022201857A1/en active Application Filing
- 2022-01-28 JP JP2023508726A patent/JPWO2022201857A1/ja active Pending
- 2022-02-14 TW TW111105241A patent/TW202300608A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022201857A1 (en) | 2022-09-29 |
| TW202300608A (en) | 2023-01-01 |