JPWO2022201224A1 - - Google Patents
Info
- Publication number
- JPWO2022201224A1 JPWO2022201224A1 JP2023508149A JP2023508149A JPWO2022201224A1 JP WO2022201224 A1 JPWO2022201224 A1 JP WO2022201224A1 JP 2023508149 A JP2023508149 A JP 2023508149A JP 2023508149 A JP2023508149 A JP 2023508149A JP WO2022201224 A1 JPWO2022201224 A1 JP WO2022201224A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2021/011624 WO2022201224A1 (ja) | 2021-03-22 | 2021-03-22 | 基板アセンブリ、基板、及び電子機器 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022201224A1 true JPWO2022201224A1 (ja) | 2022-09-29 |
Family
ID=83395374
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023508149A Pending JPWO2022201224A1 (ja) | 2021-03-22 | 2021-03-22 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20230403794A1 (ja) |
JP (1) | JPWO2022201224A1 (ja) |
CN (1) | CN116034331A (ja) |
WO (1) | WO2022201224A1 (ja) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003262884A (ja) * | 2002-03-08 | 2003-09-19 | Matsushita Electric Ind Co Ltd | 液晶表示装置 |
JP6792434B2 (ja) * | 2016-12-01 | 2020-11-25 | 株式会社ジャパンディスプレイ | 検出装置 |
JP2018200572A (ja) * | 2017-05-26 | 2018-12-20 | 株式会社ジャパンディスプレイ | 表示装置 |
-
2021
- 2021-03-22 JP JP2023508149A patent/JPWO2022201224A1/ja active Pending
- 2021-03-22 WO PCT/JP2021/011624 patent/WO2022201224A1/ja active Application Filing
- 2021-03-22 CN CN202180057006.0A patent/CN116034331A/zh active Pending
-
2023
- 2023-08-28 US US18/457,115 patent/US20230403794A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
CN116034331A (zh) | 2023-04-28 |
WO2022201224A1 (ja) | 2022-09-29 |
US20230403794A1 (en) | 2023-12-14 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240319 |