JPWO2022190600A1 - - Google Patents

Info

Publication number
JPWO2022190600A1
JPWO2022190600A1 JP2023505141A JP2023505141A JPWO2022190600A1 JP WO2022190600 A1 JPWO2022190600 A1 JP WO2022190600A1 JP 2023505141 A JP2023505141 A JP 2023505141A JP 2023505141 A JP2023505141 A JP 2023505141A JP WO2022190600 A1 JPWO2022190600 A1 JP WO2022190600A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023505141A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022190600A1 publication Critical patent/JPWO2022190600A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2023505141A 2021-03-08 2022-01-05 Pending JPWO2022190600A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021036326 2021-03-08
PCT/JP2022/000126 WO2022190600A1 (en) 2021-03-08 2022-01-05 Insulating resin composition, substrate interlayer insulating film, method for manufacturing substrate interlayer insulating film, and semiconductor ic built-in substrate

Publications (1)

Publication Number Publication Date
JPWO2022190600A1 true JPWO2022190600A1 (en) 2022-09-15

Family

ID=83227237

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023505141A Pending JPWO2022190600A1 (en) 2021-03-08 2022-01-05

Country Status (3)

Country Link
JP (1) JPWO2022190600A1 (en)
TW (1) TW202235530A (en)
WO (1) WO2022190600A1 (en)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009161578A (en) * 2007-12-28 2009-07-23 Sekisui Chem Co Ltd Insulating sheet and laminated structure
JP5260400B2 (en) * 2009-04-24 2013-08-14 パナソニック株式会社 Multilayer board for producing multilayer printed wiring boards
DE102011120200A1 (en) * 2011-12-05 2013-06-06 Clariant International Ltd. Flame retardant mixtures containing flame retardants and aluminum phosphites, process for their preparation and their use
JP2013231094A (en) * 2012-04-27 2013-11-14 Toray Ind Inc Flame-retardant adhesive composition
JP2014173008A (en) * 2013-03-08 2014-09-22 Ajinomoto Co Inc Curable resin composition
CN105061500A (en) * 2015-07-27 2015-11-18 广州金凯新材料有限公司 Superfine particle size dialkylphosphinate, preparation method and applications thereof, and high polymer composition comprising dialkylphosphinate
JP6896993B2 (en) * 2015-09-18 2021-06-30 昭和電工マテリアルズ株式会社 Resin composition, prepreg, laminated board and multi-layer printed wiring board
CN109715734B (en) * 2016-10-17 2022-03-08 松下知识产权经营株式会社 Resin composition, method for producing same, prepreg, resin-coated film, metal foil, metal-foil-clad laminate, and wiring board
JP7076263B2 (en) * 2018-03-30 2022-05-27 太陽インキ製造株式会社 Curable resin compositions, dry films, cured products, and electronic components
CN111057217B (en) * 2019-12-26 2021-08-27 广东生益科技股份有限公司 Thermosetting epoxy resin composition and prepreg, laminated board and printed circuit board using same

Also Published As

Publication number Publication date
TW202235530A (en) 2022-09-16
WO2022190600A1 (en) 2022-09-15

Similar Documents

Publication Publication Date Title
BR112023012656A2 (en)
BR102021015500A2 (en)
BR102021007058A2 (en)
BR102020022030A2 (en)
JPWO2023033131A1 (en)
BR112023011738A2 (en)
BR112023016292A2 (en)
JPWO2022190600A1 (en)
BR112023011610A2 (en)
BR112023011539A2 (en)
BR102021020147A2 (en)
BR102021018167A2 (en)
BR102021017576A2 (en)
BR102021016837A2 (en)
BR102021016551A2 (en)
BR102021016375A2 (en)
BR102021016176A2 (en)
BR102021016200A2 (en)
BR102021015566A2 (en)
BR102021015450A8 (en)
BR102021015220A2 (en)
BR102021015247A2 (en)
BR102021014044A2 (en)
BR102021014056A2 (en)
BR102021013929A2 (en)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20230622

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20240909

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240912