JPWO2022176798A1 - - Google Patents
Info
- Publication number
- JPWO2022176798A1 JPWO2022176798A1 JP2023500819A JP2023500819A JPWO2022176798A1 JP WO2022176798 A1 JPWO2022176798 A1 JP WO2022176798A1 JP 2023500819 A JP2023500819 A JP 2023500819A JP 2023500819 A JP2023500819 A JP 2023500819A JP WO2022176798 A1 JPWO2022176798 A1 JP WO2022176798A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021022905 | 2021-02-16 | ||
| PCT/JP2022/005601 WO2022176798A1 (en) | 2021-02-16 | 2022-02-14 | Bonding system, bonding method, and method for manufacturing semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022176798A1 true JPWO2022176798A1 (en) | 2022-08-25 |
Family
ID=82930583
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023500819A Pending JPWO2022176798A1 (en) | 2021-02-16 | 2022-02-14 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2022176798A1 (en) |
| WO (1) | WO2022176798A1 (en) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4822577B2 (en) * | 2000-08-18 | 2011-11-24 | 東レエンジニアリング株式会社 | Mounting method and apparatus |
| JP2004006707A (en) * | 2002-04-26 | 2004-01-08 | Toray Eng Co Ltd | Packaging method and packaging apparatus |
| JP2004103991A (en) * | 2002-09-12 | 2004-04-02 | Sony Corp | Surface cleaning device and surface cleaning method |
| JP2004200330A (en) * | 2002-12-18 | 2004-07-15 | Sony Corp | Foreign matter removing method and its apparatus |
| JP2005252176A (en) * | 2004-03-08 | 2005-09-15 | Dainippon Screen Mfg Co Ltd | Substrate processor and substrate processing method |
| EP2302670A1 (en) * | 2009-09-28 | 2011-03-30 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Place station for a pick-and-place machine |
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2022
- 2022-02-14 JP JP2023500819A patent/JPWO2022176798A1/ja active Pending
- 2022-02-14 WO PCT/JP2022/005601 patent/WO2022176798A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022176798A1 (en) | 2022-08-25 |